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Copper Foil (Light Tight)
Available Configurations
Properties common to all products in this list
| Purity | Thickness | Sides | Temper ⓘ | Other Variant |
|---|---|---|---|---|
| 99.9% (3N) to 99.9999% (6N) | 0.0005 mm (foil) to 3.25 mm (sheet) | 3 mm to 2000 mm | As Rolled Annealed Half Hard Hard |
Non Light Tested |
Need custom configurations? Please contact us.
Key Features
Copper Foil (Light Tight) is a pinhole-free copper foil that blocks all transmission of visible and near-visible light, available in purities from 3N (99.9%) to 6N (99.9999%) — combining optical barrier performance with the highest thermal and electrical conductivity of any common light-tight foil material:
Pinhole-Free Light Barrier Across Full Purity Range
Copper Foil (Light Tight) blocks all transmission of visible and near-visible light across the full purity range from 3N to 6N — making it one of the most versatile light-tight metallic foils available for both industrial and high-specification research applications where a reliable optical barrier is required.
Highest Thermal & Electrical Conductivity of Any Common Light-Tight Foil (1.69 µΩ·cm, 401 W/m·K)
With an electrical resistivity of 1.69 µΩ·cm at 20 °C and thermal conductivity of 401 W/m·K, Copper Foil (Light Tight) is uniquely capable as both an optical barrier and a highly effective thermal or electrical interface — a combination unavailable in other common light-tight foil materials.
Purity Range 3N to 6N for Application-Specific Selection
3N and 4N foils suit applications where electrical shielding and light exclusion are the primary requirements; 5N and 6N grades are selected where trace impurity levels could affect surface chemistry, electrochemical behaviour, or deposition quality in the shielded environment — allowing purity to be matched precisely to application requirements.
Formability for Complex Assembly Integration
Ductility in the soft condition and elevated tensile strength when hard-drawn allow Copper Foil (Light Tight) to be formed, wrapped, and integrated into complex assemblies with reliable barrier continuity — ensuring that the pinhole-free optical barrier is maintained through forming and installation operations.
Suited to Surface Science & Controlled Research Environments
Higher-purity 5N and 6N grades are used in surface science, photochemistry, and spectroscopy experiments where the foil forms part of a controlled, contamination-sensitive optical or electrochemical environment — providing a traceable, specification-controlled optical barrier whose surface chemistry is defined by its purity level.
Industrial Applications
Copper Foil (Light Tight) is used across optoelectronics, sensing, cryogenics, and research sectors where a pinhole-free optical barrier must also serve as a high-conductivity thermal or electrical interface:
- ✦ Shielding for Photodetectors & Light-Sensitive Semiconductors
- Used as shielding for photodetectors, light-sensitive semiconductors, and laser-based systems, where the pinhole-free structure provides complete optical exclusion and thermal conductivity of 401 W/m·K simultaneously manages heat in the shielded assembly — a combination unavailable in other common light-tight foil materials.
- ✦ EMI Enclosures for Optoelectronic Device Assemblies
- Applied in EMI enclosures for optoelectronic device assemblies where the foil must provide both electromagnetic shielding and light exclusion, and where the highest electrical conductivity of any common light-tight foil material at 1.69 µΩ·cm delivers maximum shielding effectiveness alongside a reliable optical barrier.
- ✦ Thermal Evaporation Shadow Masks
- Used as thermal evaporation shadow masks where ductility allows the foil to be formed to precise geometries with reliable barrier continuity, and the pinhole-free structure ensures that the mask completely defines the deposition pattern without light or vapour transmission through foil defects.
- ✦ Cryogenic Sensor Packaging
- Employed in cryogenic sensor packaging where light exclusion, high thermal conductivity, and the ability to be formed into complex enclosure geometries are all required in a single foil material — with higher purity grades selected where trace impurity levels at cryogenic temperatures could affect sensor performance.
- ✦ Surface Science, Photochemistry & Spectroscopy Research
- Used in surface science, photochemistry, and spectroscopy experiments at 5N and 6N purity grades, where the foil forms part of a controlled, contamination-sensitive optical or electrochemical environment and trace impurity levels at the foil surface are experimental variables that must be defined and controlled.
Material Properties
| Element | Value |
|---|---|
| Atomic number | 29 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d¹⁰ 4s¹ |
| Valences shown | 1, 2 |
| Atomic weight( amu ) | 63.546 |
| Thermal neutron absorption cross-section( Barns ) | 3.8 |
| Photo-electric work function( eV ) | 4.5 |
| Natural isotope distribution( Mass No./% ) | 65/ 30.8 |
| Natural isotope distribution( Mass No./% ) | 63/ 69.2 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 4/ 55.2 |
| Ionisation potential( No./eV ) | 6/ 103 |
| Ionisation potential( No./eV ) | 1/ 7.73 |
| Ionisation potential( No./eV ) | 5/ 79.9 |
| Ionisation potential( No./eV ) | 3/ 36.8 |
| Ionisation potential( No./eV ) | 2/ 20.29 |
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.343 |
| Poisson's ratio | 0.343 |
| Bulk modulus( GPa ) | 137.8 |
| Bulk modulus( GPa ) | 137.8 |
| Tensile modulus( GPa ) | 129.8 |
| Tensile modulus( GPa ) | 129.8 |
| Izod toughness( J m⁻¹ ) | 68 |
| Izod toughness( J m⁻¹ ) | 58 |
| Hardness - Vickers( kgf mm⁻² ) | 87 |
| Hardness - Vickers( kgf mm⁻² ) | 49 |
| Tensile strength( MPa ) | 314 |
| Tensile strength( MPa ) | 224 |
| Yield strength( MPa ) | 270 |
| Yield strength( MPa ) | 54 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 1.69@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0043@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.76 |
| Element | Value |
|---|---|
| Boiling point( C ) | 2567 |
| Density( gcm⁻³ ) | 8.96@20°C |
| Element | Value |
|---|---|
| Melting point( C ) | 1083 |
| Latent heat of evaporation( J g⁻¹ ) | 4796 |
| Latent heat of fusion( J g⁻¹ ) | 205 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 385@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 401@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@0-100°C |
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Linear dimension | <100mm | ±1mm |
| Linear dimension | >=100mm | +2 / -1% |