Copper Foil (Light Tight)

Copper Foil (Light Tight) provides high electrical conductivity and can serve as an effective light barrier laboratory and industrial applications, making it suitable for shielding photodetectors, semiconductor components, and laser-based systems. It is used in optoelectronic device assembly and research environments where both electrical and localized light shielding are required and in electrochemical systems where uniform surface coverage and barrier continuity affect reaction stability and performance. The foil’s uniform thickness and flexibility allow precise integration into layered structures for circuit protection and electromagnetic isolation. Cu foil is also used in thermal evaporation masking (as a heat-resistant shadow mask), photolithography EMI shielding (when coated to reduce reflectivity), and cryogenic sensor packaging.

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Properties

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Material Properties for Metals

Atomic Properties

Element	Value
Atomic number	29
Crystal structure	Face centred cubic
Electronic structure	Ar 3d¹⁰ 4s¹
Valences shown	1, 2
Atomic weight( amu )	63.546
Thermal neutron absorption cross-section( Barns )	3.8
Photo-electric work function( eV )	4.5
Natural isotope distribution( Mass No./% )	65/ 30.8
Natural isotope distribution( Mass No./% )	63/ 69.2
Atomic radius - Goldschmidt( nm )	0.128
Ionisation potential( No./eV )	4/ 55.2
Ionisation potential( No./eV )	6/ 103
Ionisation potential( No./eV )	1/ 7.73
Ionisation potential( No./eV )	5/ 79.9
Ionisation potential( No./eV )	3/ 36.8
Ionisation potential( No./eV )	2/ 20.29

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.343
Poisson's ratio	0.343
Bulk modulus( GPa )	137.8
Bulk modulus( GPa )	137.8
Tensile modulus( GPa )	129.8
Tensile modulus( GPa )	129.8
Izod toughness( J m⁻¹ )	68
Izod toughness( J m⁻¹ )	58
Hardness - Vickers( kgf mm⁻² )	87
Hardness - Vickers( kgf mm⁻² )	49
Tensile strength( MPa )	314
Tensile strength( MPa )	224
Yield strength( MPa )	270
Yield strength( MPa )	54

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	1.69@20@20°C
Temperature coefficient( K⁻¹ )	0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.76

Physical Properties

Element	Value
Boiling point( C )	2567
Density( gcm⁻³ )	8.96@20°C

Thermal Properties

Element	Value
Melting point( C )	1083
Latent heat of evaporation( J g⁻¹ )	4796
Latent heat of fusion( J g⁻¹ )	205
Specific heat( J K⁻¹ kg⁻¹ )	385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	17@0-100°C

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Copper Foil (Light Tight)

Material Properties for Metals