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Copper Foil

Copper Foil is widely used in electronics and scientific research because of its high electrical and thermal conductivity, making it essential in applications such as electromagnetic shielding, printed circuit board (PCB) fabrication, and battery anode current collectors. Its malleability and surface uniformity support thin-film deposition and microelectronics prototyping. In energy research, copper foil is studied for use in thin-film solar technologies and select thermal interface applications. High-purity copper foil is essential in studying thin film behavior, developing new catalysts, and exploring novel energy storage solutions. Its reliability and consistency make it valuable in laboratory R&D involving electronic materials, flexible circuits with laminate structures, and conductive coatings.
Formula: Cu
Percentage Purity: 99.9%
Temper: Annealed
Thickness: 0.1mm
Length 1: 10mm
Length 2: 10mm
CAS Number: 7440-50-8
UOM Code: 234-042-88
SKU: 1000048943
Product Code: CU00-FL-000265

Tolerances

Foil/Film/Sheet
Thickness <0.01mm ±25%
Thickness 0.01mm - 0.05mm ±15%
Thickness >0.05mm ±10%

Tolerances

Foil/Film/Sheet
Thickness <0.01mm ±25%
Thickness 0.01mm - 0.05mm ±15%
Thickness >0.05mm ±10%
Technical Data Sheet
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$235.56
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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 29
Crystal structure Face centred cubic
Electronic structure Ar 3d¹⁰ 4s¹
Valences shown 1, 2
Atomic weight( amu ) 63.546
Thermal neutron absorption cross-section( Barns ) 3.8
Photo-electric work function( eV ) 4.5
Natural isotope distribution( Mass No./% ) 65/ 30.8
Natural isotope distribution( Mass No./% ) 63/ 69.2
Atomic radius - Goldschmidt( nm ) 0.128
Ionisation potential( No./eV ) 4/ 55.2
Ionisation potential( No./eV ) 6/ 103
Ionisation potential( No./eV ) 1/ 7.73
Ionisation potential( No./eV ) 5/ 79.9
Ionisation potential( No./eV ) 3/ 36.8
Ionisation potential( No./eV ) 2/ 20.29
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.343
Poisson's ratio 0.343
Bulk modulus( GPa ) 137.8
Bulk modulus( GPa ) 137.8
Tensile modulus( GPa ) 129.8
Tensile modulus( GPa ) 129.8
Izod toughness( J m⁻¹ ) 68
Izod toughness( J m⁻¹ ) 58
Hardness - Vickers( kgf mm⁻² ) 87
Hardness - Vickers( kgf mm⁻² ) 49
Tensile strength( MPa ) 314
Tensile strength( MPa ) 224
Yield strength( MPa ) 270
Yield strength( MPa ) 54
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 1.69@20@20°C
Temperature coefficient( K⁻¹ ) 0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.76
Physical Properties
Element Value
Boiling point( C ) 2567
Density( gcm⁻³ ) 8.96@20°C
Thermal Properties
Element Value
Melting point( C ) 1083
Latent heat of evaporation( J g⁻¹ ) 4796
Latent heat of fusion( J g⁻¹ ) 205
Specific heat( J K⁻¹ kg⁻¹ ) 385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 17@0-100°C
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