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Copper Disk
Available Configurations
Properties common to all products in this list
Key Features
Copper Disk is a precision-cut circular copper component available in purities from 3N (99.9%) to 6N (99.9999%), covering the range from general industrial and engineering use through to the highest purity grades demanded by semiconductor processing, surface science, and thin-film research:
Purity Range 3N to 6N for Application-Specific Selection
The choice of purity grade matters directly: higher purity disks carry fewer trace impurities that could contaminate sensitive processes, skew electrochemical measurements, or compromise surface integrity in deposition work, while 3N and 4N grades are well suited to thermal management, electrical contact, and fabrication applications where cost efficiency is the priority.
Benchmark Electrical & Thermal Performance (1.69 µΩ·cm, 401 W/m·K)
Across all purity grades, Copper Disk delivers an electrical resistivity of 1.69 µΩ·cm at 20 °C and thermal conductivity of 401 W/m·K — establishing it as the benchmark conductor for thermal spreaders, heat sink substrates, and electrical contact blanks where maximising heat dissipation and minimising resistive losses are primary requirements.
Good Ductility & Machinability in Both Soft and Hard Conditions
Copper Disk's face-centred cubic structure gives good ductility and machinability in both soft and hard conditions, making it straightforward to machine into polishing laps, contact blanks, and custom circular components without specialist processing across the full purity range.
Versatile Platform for Comparative Research
The availability of multiple purity grades in a single disk format makes Copper Disk a versatile platform for comparative studies of impurity effects on surface reactivity, grain boundary behaviour, catalytic activity, and electrical performance — wherever a well-characterised, traceable copper substrate with a defined purity level is an experimental requirement.
Precision Circular Geometry for Direct-Fit Applications
The precision-cut circular geometry makes Copper Disk a direct-fit component for thermal spreaders, heat sink substrates, polishing laps, electrochemical electrode blanks, and reference material coupons — applications where dimensional accuracy and a defined circular form simplify integration into instruments, assemblies, and test rigs.
Industrial Applications
Copper Disk is used across thermal management, electronics, metrology, and research sectors where a precision circular copper component in a defined purity grade is required:
- ✦ Thermal Spreaders & Heat Sink Substrates
- Used as thermal spreaders and heat sink substrates in high-power electronics and laser systems, where thermal conductivity of 401 W/m·K in a precision circular form provides efficient heat distribution into cooling systems — with 3N and 4N grades suited to most thermal management applications where maximum purity is not required.
- ✦ Electrical Contact Blanks
- Machined into electrical contact blanks for switches, relays, and precision instruments, where the combination of lowest metallic resistivity, good machinability from the face-centred cubic structure, and availability across multiple purity grades allows contact resistance and material cost to be optimised for the specific application.
- ✦ Polishing Laps for Optical & Wafer Processing
- Applied as polishing laps in optical and semiconductor wafer processing, where the precision circular geometry and machinability of copper disk provide a controlled, dimensionally accurate lapping surface for finishing optical components and semiconductor substrates to tight surface specifications.
- ✦ Thin-Film Deposition Substrates
- Used as thin-film deposition substrates in semiconductor processing and surface science research, where 5N and 6N purity grades ensure that trace impurities do not contaminate the deposition environment or compromise the surface integrity and adhesion of deposited films.
- ✦ Electrochemical Electrode Blanks & Conductivity Reference Coupons
- Employed as electrochemical electrode blanks and reference material coupons for conductivity and corrosion testing, where the availability of multiple purity grades in a single disk format supports comparative studies of impurity effects on electrochemical behaviour, surface reactivity, and corrosion performance under controlled experimental conditions.
Material Properties
| Element | Value |
|---|---|
| Atomic number | 29 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d¹⁰ 4s¹ |
| Valences shown | 1, 2 |
| Atomic weight( amu ) | 63.546 |
| Thermal neutron absorption cross-section( Barns ) | 3.8 |
| Photo-electric work function( eV ) | 4.5 |
| Natural isotope distribution( Mass No./% ) | 65/ 30.8 |
| Natural isotope distribution( Mass No./% ) | 63/ 69.2 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 4/ 55.2 |
| Ionisation potential( No./eV ) | 6/ 103 |
| Ionisation potential( No./eV ) | 1/ 7.73 |
| Ionisation potential( No./eV ) | 5/ 79.9 |
| Ionisation potential( No./eV ) | 3/ 36.8 |
| Ionisation potential( No./eV ) | 2/ 20.29 |
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.343 |
| Poisson's ratio | 0.343 |
| Bulk modulus( GPa ) | 137.8 |
| Bulk modulus( GPa ) | 137.8 |
| Tensile modulus( GPa ) | 129.8 |
| Tensile modulus( GPa ) | 129.8 |
| Izod toughness( J m⁻¹ ) | 68 |
| Izod toughness( J m⁻¹ ) | 58 |
| Hardness - Vickers( kgf mm⁻² ) | 87 |
| Hardness - Vickers( kgf mm⁻² ) | 49 |
| Tensile strength( MPa ) | 314 |
| Tensile strength( MPa ) | 224 |
| Yield strength( MPa ) | 270 |
| Yield strength( MPa ) | 54 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 1.69@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0043@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.76 |
| Element | Value |
|---|---|
| Boiling point( C ) | 2567 |
| Density( gcm⁻³ ) | 8.96@20°C |
| Element | Value |
|---|---|
| Melting point( C ) | 1083 |
| Latent heat of evaporation( J g⁻¹ ) | 4796 |
| Latent heat of fusion( J g⁻¹ ) | 205 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 385@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 401@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@0-100°C |
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Diameter | ±0.5mm |