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Copper-Beryllium Foil (Light Tight) (Cu98-Be2)
Available Configurations
Properties common to all products in this list
| Thickness | Size | Temper ⓘ |
|---|---|---|
| 0.005 mm to 6.35 mm | 10 x 10 mm to 200 x 1000 mm | As rolled Annealed Quarter hard Half hard Hard |
Need custom configurations? Please contact us.
Acute toxicity
Serious health hazard
Key Features
Copper-Beryllium Alloy Foil (Light Tight) (Cu 98/Be 2) is a pinhole-free certified precipitation-hardened copper-beryllium alloy foil combining high strength, good electrical conductivity, non-sparking character, and non-magnetic behavior with guaranteed through-thickness barrier integrity:
Pinhole-Free Certification
Each batch is tested and certified clear of through-thickness defects, providing reliable optical, gaseous, and electromagnetic barrier performance in applications where the alloy’s high strength, conductivity, and non-magnetic character must coexist with complete barrier continuity.
High Strength with Non-Magnetic Character
Tensile strength of 800–1,400 MPa in the peak-aged condition provides greater structural resistance than standard non-magnetic metals at comparable foil gauge, making this the appropriate choice where a high-strength non-magnetic certified barrier is required and lower-strength alternatives are inadequate.
Non-Sparking Barrier Performance
The non-sparking character of the Cu-Be alloy qualifies this light tight foil for barrier gaskets and shielding elements in explosive-area instrumentation, where non-sparking character and optical isolation are simultaneously required in the same component.
Excellent Spring and Fatigue Properties
Excellent spring and fatigue properties in the peak-aged condition support spring-loaded optical shutter and aperture elements that must maintain defined spring force and geometric accuracy through extended operating cycles while providing complete optical isolation.
Health and Safety Classification
Beryllium is classified as carcinogenic to humans (IARC Group 1). Applicable occupational safety regulations must be followed when handling.
Industrial Applications
Copper-Beryllium Alloy Foil (Light Tight) is used wherever high-strength non-magnetic certified barrier integrity and non-sparking character must coexist in a single foil component:
- ✦ Shielding Elements in High-Strength Non-Magnetic Electromagnetic Instrumentation
- Used for shielding elements in electromagnetic instrumentation requiring high-strength non-magnetic barrier integrity, where the 800–1,400 MPa tensile strength and confirmed non-magnetic character provide structural and electromagnetic shielding performance unavailable in lower-strength non-magnetic foil alternatives.
- ✦ Spring-Loaded Optical Shutter Elements in Analytical Instruments
- Applied as spring-loaded optical shutter elements in analytical instruments, where the excellent fatigue resistance and spring properties of the peak-aged Cu-Be alloy maintain reliable shutter operation over extended service life while the pinhole-free certification ensures complete optical isolation.
- ✦ Precision Barrier Gaskets in Explosive-Area Instrumentation
- Used as precision barrier gaskets in explosive-area instrumentation where non-sparking character and optical isolation are simultaneously required, a combination achievable in no standard alternative foil material at comparable structural performance.
- ✦ Non-Magnetic Containment for Photometric and Spectroscopic Research
- Provides certified barrier stock for photometric and spectroscopic experiments requiring non-magnetic containment, where the combination of confirmed non-magnetic character and pinhole-free barrier integrity qualifies Cu-Be light tight foil for use in magnetically sensitive analytical setups requiring optical isolation.
- ✦ Spring Property and Barrier Integrity Research in Precipitation-Hardened Copper Alloys
- Provides a model material for combined spring property and barrier integrity investigations in precipitation-hardened copper alloy foil, where the relationship between age-hardening condition, spring performance, and through-thickness barrier quality can be systematically characterized.
Material Properties
| Element | Value |
|---|---|
| Hardness - Brinell | 100-360 |
| Elongation at break( % ) | 50 |
| Modulus of elasticity( GPa ) | 120-160 |
| Tensile strength( MPa ) | 500-1300 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 5.4-11.5 |
| Temperature coefficient( K⁻¹ ) | 0.001-0.0018 |
| Element | Value |
|---|---|
| Melting point( C ) | 860-1000 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 60-120@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@25-300°C |
| Element | Value |
|---|---|
| Density( gcm⁻³ ) | 8.25 |
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Linear dimension | <100mm | ±1mm |
| Linear dimension | >=100mm | +2 / -1% |