Constantan® Sputtering Target

Constantan® Sputtering Target, composed of approximately 55% copper and 45% nickel, is engineered for high-uniformity thin film deposition via physical vapor deposition (PVD). Known for its stable electrical resistivity and low thermal EMF against copper, Constantan® delivers precise and repeatable film properties, making it indispensable in electronics, sensing, and thermoelectric research. The sputtering target form enables deposition of films for strain gauges, resistive elements, and precision temperature compensation layers in microelectronic devices. Industries such as aerospace, semiconductor manufacturing, and advanced metrology utilize these targets for applications including patterned resistive networks, thin-film thermocouples, and sensor calibration elements. Technologies benefiting from Constantan® sputtering include magnetron sputtering for integrated circuits, thin-film fabrication for MEMS devices, and coating systems for optical-electronic hybrids. Current research emphasizes controlling target microstructure and composition uniformity to enhance deposition rates, reduce defects, and improve film adhesion, ensuring optimal performance in next-generation thin-film manufacturing.

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Properties

Reference & Citations

Health hazard/Hazardous to the ozone layer

Serious health hazard

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Material Properties for Alloys

Mechanical Properties

Element	Value
Hardness - Brinell	100-300
Elongation at break( % )	45
Modulus of elasticity( GPa )	162
Izod impact strength( J m⁻¹ )	107
Tensile strength( MPa )	400-590

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	52
Temperature coefficient( K⁻¹ )	0.00002+/-

Thermal Properties

Element	Value
Maximum use temperature in air( C )	500
Melting point( C )	1225-1300
Thermal conductivity( W m⁻¹ K⁻¹ )	19.5@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	14.9@20-100°C