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Formula: Sn based
Form: Foil/Film/Sheet
Material: C-Solder® Alloy
Commodity: Alloys
Temper: As Rolled
Type: Solder

C-Solder Alloy Foil (Sn based)

C-Solder Alloy Foil (Sn based) is made from a proprietary alloy composition and offers high electrical and thermal conductivity, as well as excellent ductility. This foil is designed for use as a bonding medium in electronic packaging and heat sink applications. We offer C-Solder® Foil in 6 thicknesses and dimensions to suit different production needs.
each

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Tolerances

Foil/Film/Sheet
Thickness <0.01mm ±25%
Thickness 0.01mm - 0.05mm ±25%
Thickness >0.05mm ±10%

Material Properties for Alloys

Thermal Properties
Element Value
Melting point( C ) 232
Physical Properties
Element Value
Density( gcm⁻³ ) 7.4

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