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Brass Foil/Sheet (Cu63-Zn37)
Available Configurations
Properties common to all products in this list
| Thickness | Size | Temper ⓘ |
|---|---|---|
| 0.005 mm (foil) to 6 mm (sheet) | 10 x 10 mm to 600 x 600 mm | As rolled Half hard Hard |
Need custom configurations? Please contact us.
Key Features
Brass Foil (Cu 63/Zn 37) is an alpha-brass alloy foil combining good tensile strength, excellent formability, good electrical conductivity, and a well-characterized bright surface finish, established as a reference material across decorative, electronic, and precision engineering applications:
Single-Phase Alpha Structure for Good Cold Workability
The Cu63/Zn37 composition produces a single-phase alpha structure that gives good cold workability without the dezincification susceptibility of higher-zinc grades, supporting demanding forming, stamping, and roll processing operations without phase instability or selective corrosion concern.
Well-Characterized Bright Surface Finish
The bright surface finish is well-characterized and accepts a wide range of plating operations including tin, silver, nickel, and gold, making brass foil the standard plating substrate in electronics manufacturing and decorative applications where a plateable copper alloy base is required.
Good Electrical and Thermal Performance
Electrical resistivity of approximately 6.5 µΩ·cm and thermal conductivity of approximately 109 W/m·K provide a useful balance of electrical and thermal performance in a highly formable format, supporting connector, spring, and heat spreader foil applications.
Excellent Formability
The combination of single-phase alpha structure, good ductility, and the Cu63/Zn37 composition’s established cold-working response supports precision stampings, deep-drawn components, and fine spring elements where tight dimensional tolerances in the formed condition are required.
Density and Physical Properties
Density of approximately 8.5 g/cm³ gives brass foil the mass characteristics typical of copper alloys, with physical properties well-characterized across the full range of engineering design standards for connector, spring, and decorative applications.
Industrial Applications
Brass Foil is used across electronics, precision engineering, architecture, and decorative applications wherever formability, plateable surface, and the well-characterized electrical and mechanical properties of the Cu63/Zn37 composition determine material selection:
- ✦ Precision Stampings and Connector Elements
- Used for precision stampings and connector elements in electronics manufacturing, where the single-phase alpha structure’s cold-working response supports tight-tolerance stamped contacts, spring contacts, and connector bodies in the most common copper alloy foil format.
- ✦ Spring Elements and Bearing Shims
- Applied as spring elements and bearing shims in precision instruments and mechanical assemblies, where the combination of formability, consistent spring-back, and electrical conductivity qualifies brass foil for spring contact and shimming applications.
- ✦ Decorative and Architectural Facings
- Used for decorative and architectural facings in building interiors and furniture, where the bright surface finish, formability, and established aesthetic character of brass support a wide range of decorative laminate, inlay, and facing applications.
- ✦ Flexible Heat Spreader Foils
- Applied as flexible heat spreader foils in electronic assemblies, where thermal conductivity of approximately 109 W/m·K and formability support conformation to component surfaces and spreading of heat from localized sources.
- ✦ Plating Substrate in Electronics Manufacturing
- Used as a plating substrate for tin, silver, nickel, and gold in electronics manufacturing, where the bright surface finish and established electroplating adhesion of the Cu63/Zn37 base metal provide a consistent foundation for plateable connector, contact, and terminal products.
- ✦ Electrochemical, SERS and Corrosion Research
- Serves as a model copper alloy for electrochemical deposition and etching studies, as a substrate for surface-enhanced Raman spectroscopy experiments, for corrosion characterization of brass alloys in atmospheric and aqueous environments, and as a reference copper-zinc alloy specimen for diffusion couple and thermodynamic investigations.
Material Properties
| Element | Value |
|---|---|
| Hardness - Brinell | 65-136 |
| Elongation at break( % ) | 55 |
| Modulus of elasticity( GPa ) | 95-110 |
| Shear strength( MPa ) | 280-310 |
| Tensile strength( MPa ) | 330-500 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 6.2-6.6 |
| Temperature coefficient( K⁻¹ ) | 0.0016-0.0017 |
| Element | Value |
|---|---|
| Melting point( C ) | 900-920 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 125@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 19-20.5@20-100°C |
| Element | Value |
|---|---|
| Density( gcm⁻³ ) | 8.45 |
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Linear dimension | <100mm | ±1mm |
| Linear dimension | >=100mm | +2 / -1% |