Borosilicate Glass-Insulated Ultrafine Gold Wire

Borosilicate Glass-Insulated Ultrafine Gold Wire features a high-purity (≥99.99%) gold conductor encased in a thin borosilicate glass coating. This combination provides excellent thermal resistance, chemical inertness, and electrical insulation. The borosilicate sheath remains stable during high-temperature processing, making the wire ideal for microelectronic assemblies, high-frequency signal transmission, and semiconductor applications. Common uses include vacuum-sealed interconnects, fine bonding wires for ICs, and instrumentation for extreme environments. Gold ensures minimal resistive loss, while borosilicate glass acts as a reliable dielectric barrier, even under thermal cycling. Studies confirm its performance in shallow doping techniques and high-precision bonding, with added dopants enhancing tensile strength and recrystallization behavior. This wire supports the development of miniaturized, high-reliability components across aerospace, medical, and advanced electronics sectors.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Insulated Wire

Conductor Diameter		±10%
Insulation Thickness		Nominal
Length		+5% / -1%

Material Properties for Precious Metals

Atomic Properties

Element	Value
Atomic number	79
Crystal structure	Face centred cubic
Electronic structure	Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown	1,3
Atomic weight( amu )	196.9665
Thermal neutron absorption cross-section( Barns )	98.8
Photo-electric work function( eV )	4.8
Atomic radius - Goldschmidt( nm )	0.144
Ionisation potential( No./eV )	1/ 9.22
Ionisation potential( No./eV )	2/ 20.5

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.42
Poisson's ratio	0.42
Bulk modulus( GPa )	171
Bulk modulus( GPa )	171
Tensile modulus( GPa )	78.5
Tensile modulus( GPa )	78.5
Hardness - Vickers( kgf mm⁻² )	20-30
Hardness - Vickers( kgf mm⁻² )	60
Tensile strength( MPa )	130
Tensile strength( MPa )	220
Yield strength( MPa )	205
Yield strength( MPa )	-

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	2.20@20@20°C
Temperature coefficient( K⁻¹ )	0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.74

Physical Properties

Element	Value
Boiling point( C )	3080
Density( gcm⁻³ )	19.3@20°C

Thermal Properties

Element	Value
Melting point( C )	1064.4
Latent heat of evaporation( J g⁻¹ )	1738
Latent heat of fusion( J g⁻¹ )	64.9
Specific heat( J K⁻¹ kg⁻¹ )	129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	14.1@0-100°C