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ARMCO® soft ingot Iron Foil (Light Tight)
Available Configurations
Properties common to all products in this list
| Thickness | Sides | Other Variant |
|---|---|---|
| 1 mm (foil) to 10 mm (plate) | 25 mm to 2000 mm | Non Light Tested ARMCO®; Pinhole-Free Standard Iron |
Need custom configurations? Please contact us.
Key Features
ARMCO® Soft Ingot Iron Foil (Light Tight) at 99.8% purity is a pinhole-free version of the high-purity, ultra-low carbon iron foil that combines complete optical opacity with the very low coercivity and high magnetic permeability that make ARMCO® soft ingot iron valuable in magnetic shielding and flux control applications:
Pinhole-Free Optical Barrier with Very Low Coercivity & High Magnetic Permeability
ARMCO® Soft Ingot Iron Foil (Light Tight) combines complete optical opacity with the very low coercivity and high magnetic permeability that make ARMCO® soft ingot iron valuable in magnetic shielding and flux control applications — delivering both functions in a single pinhole-free foil component.
Uniform Composition & Minimal Inclusions Preserved in the Light-Tight Format
Uniform composition and minimal inclusions ensure consistent magnetic behavior is preserved even where the foil must also serve as a light-excluding barrier, supporting use in cryogenics, spintronics, and particle beamline assemblies where both optical isolation and magnetic reproducibility are simultaneous requirements.
Ultra-High Vacuum Compatibility & Ease of Cold Forming for Sensitive Research Platforms
The alloy's compatibility with ultra-high vacuum (UHV) systems and ease of cold forming extend its utility to sensitive research platforms requiring a magnetically well-behaved, light-tight barrier — allowing the foil to be formed into precision light-excluding magnetic components without compromising UHV system cleanliness.
Light-Shielded Magnetic Flux Return Paths & Optically Isolated Transformer Lamination Assemblies
Typical applications include light-shielded magnetic flux return paths, optically isolated transformer lamination assemblies, and shielding components for low-temperature magnetic measurement apparatus where stray light must be excluded alongside reliable, well-controlled magnetic flux conduction.
Magnetic Field Control Combined with Light Exclusion for Cryogenic, Spintronic & Beamline Environments
In research, ARMCO® Soft Ingot Iron Foil (Light Tight) is used wherever magnetic field control components must also block light transmission in cryogenic, spintronic, or beamline environments — providing a single-component solution combining well-characterized magnetic behavior with complete optical isolation.
Industrial Applications
ARMCO® Soft Ingot Iron Foil (Light Tight) is used in cryogenic, spintronic, and beamline research wherever magnetic field control components must also provide complete optical isolation:
- ✦ Light-Shielded Magnetic Flux Return Paths
- Used as light-shielded magnetic flux return paths, where the foil's very low coercivity and high magnetic permeability provide efficient flux conduction while the pinhole-free construction simultaneously excludes ambient light from the surrounding experimental environment.
- ✦ Optically Isolated Transformer Lamination Assemblies
- Applied in optically isolated transformer lamination assemblies, where ARMCO® Soft Ingot Iron Foil (Light Tight) combines reliable magnetic flux conduction with complete light exclusion — supporting transformer designs in optically sensitive instrumentation where stray light must be prevented from reaching nearby photosensitive components.
- ✦ Shielding Components for Low-Temperature Magnetic Measurement Apparatus
- Used as shielding components for low-temperature magnetic measurement apparatus where stray light must be excluded, with the foil's uniform composition and minimal inclusions ensuring that magnetic measurement accuracy is preserved within the optically isolated enclosure.
- ✦ UHV-Compatible Magnetic Field Control Components
- Used in UHV-compatible magnetic field control components requiring a magnetically well-behaved, light-tight barrier, where ease of cold forming supports integration into sensitive research platforms without compromising vacuum system cleanliness or magnetic performance.
- ✦ Research: Magnetic Field Control in Cryogenic, Spintronic & Beamline Environments Requiring Light Exclusion
- Used in research wherever magnetic field control components must also block light transmission in cryogenic, spintronic, or beamline environments — providing a single foil component that combines well-characterized magnetic reproducibility with the complete optical isolation required for photosensitive experimental setups.
Material Properties
| Element | Value |
|---|---|
| Atomic number | 26 |
| Crystal structure | Body centred cubic |
| Electronic structure | Ar 3d⁶ 4s² |
| Valences shown | 2, 3, 4, 6 |
| Atomic weight( amu ) | 55.847 |
| Thermal neutron absorption cross-section( Barns ) | 2.56 |
| Photo-electric work function( eV ) | 4.4 |
| Natural isotope distribution( Mass No./% ) | 58/ 0.3 |
| Natural isotope distribution( Mass No./% ) | 57/ 2.1 |
| Natural isotope distribution( Mass No./% ) | 56/ 91.8 |
| Natural isotope distribution( Mass No./% ) | 54/ 5.8 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 2/ 16.18 |
| Ionisation potential( No./eV ) | 5/ 75.0 |
| Ionisation potential( No./eV ) | 4/ 54.8 |
| Ionisation potential( No./eV ) | 3/ 30.65 |
| Ionisation potential( No./eV ) | 1/ 7.87 |
| Ionisation potential( No./eV ) | Jun-99 |
| Element | Value |
|---|---|
| Hardness - Mohs | 04-5 |
| Material condition | Polycrystalline |
| Poisson's ratio | 0.293 |
| Bulk modulus( GPa ) | 169.8 |
| Tensile modulus( GPa ) | 211.4 |
| Izod toughness( J m⁻¹ ) | 8-16 |
| Tensile strength( MPa ) | 180-210 |
| Yield strength( MPa ) | 120-150 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 10.1@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0065@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 1.98 |
| Element | Value |
|---|---|
| Boiling point( C ) | 2750 |
| Density( gcm⁻³ ) | 7.87@20°C |
| Element | Value |
|---|---|
| Melting point( C ) | 1535 |
| Latent heat of evaporation( J g⁻¹ ) | 6095 |
| Latent heat of fusion( J g⁻¹ ) | 272 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 444@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 80.4@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 12.1@0-100°C |
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Linear dimension | <100mm | ±1mm |
| Linear dimension | >=100mm | +2 / -1% |