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Aluminum Spooled Wire
Available Configurations
Properties common to all products in this list
| Purity | Diameter | Length | Temper ⓘ |
|---|---|---|---|
| 99% (2N) to 99.999% (5N) | 0.015 mm to 4 mm | 0.012 m to 10,000 m | Annealed As Drawn Hard |
Need custom configurations? Please contact us.
Key Features
Aluminum Spooled Wire is available in purities from 99% (2N) to 99.999% (5N) in annealed, as-drawn, and hard tempers, spanning the widest purity range of any spooled wire in the Goodfellow catalog:
Electrical Conductivity Approximately 61% IACS, Increasing with Purity
Aluminum’s electrical conductivity of approximately 61% of the IACS copper standard makes it the most widely specified material for overhead power transmission conductors and coil winding applications where weight savings relative to copper are a design priority. Conductivity increases further at higher purity grades.
Widest Purity Range in the Goodfellow Spooled Wire Catalog (2N to 5N)
The 2N to 5N purity range spans from high-volume industrial conductor grades through to the ultra-high purity required for semiconductor bond wire and precision electrochemical research, where freedom from trace metallic contamination is a specification requirement.
Three Tempers for Different Mechanical Requirements
The annealed condition provides the ductility needed for fine-gauge drawing, coil winding, and wire bonding. As-drawn and hard tempers deliver the spring stiffness required for formed contact elements and antenna wire.
Face-Centered Cubic Structure for Cold-Drawing and Wire Bonding
Aluminum’s face-centered cubic structure gives it excellent cold-drawing performance and bondability, supporting both high-volume conductor manufacture and the thermocompression and thermosonic bonding processes used in semiconductor device packaging.
Model FCC Metal for Physical Metallurgy Research
High-purity aluminum wire is a well-established model material for investigations into grain boundary behavior, recrystallization, and the mechanical properties of face-centered cubic metals, where the absence of alloying elements allows intrinsic material behavior to be studied without compositional variables.
Industrial Applications
Aluminum Spooled Wire is used across power transmission, semiconductor packaging, and research wherever aluminum’s conductivity, low density, and purity range determine material selection:
- ✦ Overhead Power Transmission Conductors
- Used as the primary conductor material in overhead power transmission, where approximately 61% IACS conductivity combined with a density of 2.7 g/cm³ delivers lower line weight than copper at equivalent current-carrying capacity.
- ✦ Transformer and Motor Coil Winding
- Applied in transformer and motor coil winding where weight savings relative to copper are a design priority and the annealed condition provides the ductility for tight, consistent winding geometry.
- ✦ Semiconductor Bond Wire
- 4N and 5N purity grades are used as bond wire in semiconductor device packaging, connecting die to leadframe where low resistivity, good bondability, and freedom from trace metallic contamination are essential to device yield and reliability.
- ✦ Electrochemical Anode Material and Corrosion Studies
- Applied as an electrochemical anode material and test specimen in corrosion studies, where controlled purity allows systematic investigation of composition effects on passivation, dissolution, and corrosion behavior.
- ✦ Sputter Deposition and Evaporation Target Feedstock
- Used as target feedstock for sputter deposition and thermal evaporation, where purity grade selection controls film composition and trace impurity incorporation in deposited aluminum thin films.
- ✦ Grain Boundary and Recrystallization Research
- High-purity wire supports investigations into grain boundary behavior, recrystallization, and mechanical properties of face-centered cubic metals, where well-characterized purity and the coil format provide a consistent, traceable substrate across extended experimental programmes.
Material Properties
| Element | Value |
|---|---|
| Atomic number | 13 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ne 3s² 3p¹ |
| Valences shown | 3 |
| Atomic weight( amu ) | 26.98154 |
| Thermal neutron absorption cross-section( Barns ) | 0.232 |
| Photo-electric work function( eV ) | 4.2 |
| Atomic radius - Goldschmidt( nm ) | 0.143 |
| Ionisation potential( No./eV ) | 4/ 120 |
| Ionisation potential( No./eV ) | 5/ 154 |
| Ionisation potential( No./eV ) | 6/ 190 |
| Ionisation potential( No./eV ) | 1/ 5.99 |
| Ionisation potential( No./eV ) | 3/ 28.4 |
| Ionisation potential( No./eV ) | 2/ 18.8 |
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.345 |
| Poisson's ratio | 0.345 |
| Bulk modulus( GPa ) | 75.2 |
| Bulk modulus( GPa ) | 75.2 |
| Tensile modulus( GPa ) | 70.6 |
| Tensile modulus( GPa ) | 70.6 |
| Hardness - Vickers( kgf mm⁻² ) | 21 |
| Hardness - Vickers( kgf mm⁻² ) | 35-48 |
| Tensile strength( MPa ) | 130-195 |
| Tensile strength( MPa ) | 50-90 |
| Yield strength( MPa ) | 110-170 |
| Yield strength( MPa ) | 10‑35 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 2.67@20°C |
| Superconductivity critical temperature( K ) | 1.175 |
| Temperature coefficient( K⁻¹ ) | 0.0045@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.42 |
| Element | Value |
|---|---|
| Boiling point( C ) | 2467 |
| Density( gcm⁻³ ) | 2.7@20°C |
| Element | Value |
|---|---|
| Melting point( C ) | 660.4 |
| Latent heat of evaporation( J g⁻¹ ) | 10800 |
| Latent heat of fusion( J g⁻¹ ) | 388 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 900@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 237@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 23.5@0-100°C |
Tolerances
| Diameter | ±10% | |
|---|---|---|
| Length | +5% / -1% |