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Additive Free Polymer Polystyrene Film

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Commodity: Polymers Material: Polystyrene (PS) Form: Foil/Film/Sheet Composition: PS Grade: Additive Free Polymer
Additive-Free Polymer Polystyrene (PS) Film provides a clean, interference-free and uniform surface free of stabilizers and plasticizers, making it ideal for spin coating, photolithography, and thin-film device fabrication. Its consistent dielectric behavior and chemical purity allow accurate analysis of properties and performance in electrical and surface studies. In research and laboratory environments, this film is used in biomedical setups for short-term cell culture with plasma treatment, protein adsorption studies, and microfluidic device integration. It also supports lab-scale organic electronics, including OFETs and capacitors, contributing to advancements in polymer physics, surface engineering, and materials science experimentation.
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Material Properties

Physical Properties
Element Value
Abbe number 30.8
Flammability HB
Radiation resistance Good
Refractive index 1.59-1.6
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 19
Water absorption - over 24 hours( % ) 0.4
Density( gcm⁻³ ) 1.05
Chemical Resistance
Element Value
Acids - concentrated Fair-Poor
Acids - dilute Good-Fair
Alcohols Good-Fair
Alkalis Good-Fair
Aromatic hydrocarbons Poor
Greases and Oils Good-Poor
Halogenated Hydrocarbons Poor
Halogens Poor
Ketones Poor
Electrical Properties
Element Value
Dielectric constant @1MHz 2.4-3.1
Dissipation factor @ 1kHz 0.0002
Dielectric strength( kV mm⁻¹ ) 20
Volume resistivity( Ohmcm ) >10¹⁶
Mechanical Properties
Element Value
Hardness - Rockwell M60-90
Poisson's ratio 0.35
Elongation at break( % ) 1.6
Tensile modulus( GPa ) 2.3-4.1
Izod impact strength( J m⁻¹ ) 19-24
Tensile strength( MPa ) 30-100
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 90
Heat-deflection temperature - 1.8MPa( C ) 80
Upper working temperature( C ) 50-95
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-210
each

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Properties common to all products in this list

Commodity: Polymers Material: Polystyrene (PS) Form: Foil Composition: PS Grade: Additive Free Polymer

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Tolerances

Foil
Thickness ±20%
Linear dimension <100mm ±1mm
Linear dimension >=100mm +2 / -1%