Additive Free Polymer PS Film

Additive-Free Polymer Polystyrene (PS) Film provides a clean, interference-free and uniform surface free of stabilizers and plasticizers, making it ideal for spin coating, photolithography, and thin-film device fabrication. Its consistent dielectric behavior and chemical purity allow accurate analysis of properties and performance in electrical and surface studies. In research and laboratory environments, this film is used in biomedical setups for short-term cell culture with plasma treatment, protein adsorption studies, and microfluidic device integration. It also supports lab-scale organic electronics, including OFETs and capacitors, contributing to advancements in polymer physics, surface engineering, and materials science experimentation.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Foil/Film/Sheet

Thickness		±20%

Material Properties for Polymers

Physical Properties

Element	Value
Abbe number	30.8
Flammability	HB
Radiation resistance	Good
Refractive index	1.59-1.6
Resistance to Ultra-violet	Poor
Limiting oxygen index( % )	19
Water absorption - over 24 hours( % )	0.4
Density( gcm⁻³ )	1.05

Chemical Resistance

Element	Value
Acids - concentrated	Fair-Poor
Acids - dilute	Good-Fair
Alcohols	Good-Fair
Alkalis	Good-Fair
Aromatic hydrocarbons	Poor
Greases and Oils	Good-Poor
Halogenated Hydrocarbons	Poor
Halogens	Poor
Ketones	Poor

Electrical Properties

Element	Value
Dielectric constant @1MHz	2.4-3.1
Dissipation factor @ 1kHz	0.0002
Dielectric strength( kV mm⁻¹ )	20
Volume resistivity( Ohmcm )	>10¹⁶

Mechanical Properties

Element	Value
Hardness - Rockwell	M60-90
Poisson's ratio	0.35
Elongation at break( % )	1.6
Tensile modulus( GPa )	2.3-4.1
Izod impact strength( J m⁻¹ )	19-24
Tensile strength( MPa )	30-100

Thermal Properties

Element	Value
Heat-deflection temperature - 0.45MPa( C )	90
Heat-deflection temperature - 1.8MPa( C )	80
Upper working temperature( C )	50-95
Specific heat( J K⁻¹ kg⁻¹ )	1200
Thermal conductivity( W m⁻¹ K⁻¹ )	0.1-0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	30-210