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Grade: Additive Free Polymer
Composition: PS
Form: Foil/Film/Sheet
Material: Polystyrene (PS)
Commodity: Polymers
Thickness:
0.05mm
Structure:
Biaxially Oriented
Transparency:
Clear/Transparent
Additive-Free Polymer Polystyrene (PS) Film provides a clean, interference-free and uniform surface free of stabilizers and plasticizers, making it ideal for spin coating, photolithography, and thin-film device fabrication. Its consistent dielectric behavior and chemical purity allow accurate analysis of properties and performance in electrical and surface studies. In research and laboratory environments, this film is used in biomedical setups for short-term cell culture with plasma treatment, protein adsorption studies, and microfluidic device integration. It also supports lab-scale organic electronics, including OFETs and capacitors, contributing to advancements in polymer physics, surface engineering, and materials science experimentation.
Tolerances
Foil
| Thickness | ±20% |
|---|
Material Properties for Polymers
Physical Properties
| Element | Value |
|---|---|
| Abbe number | 30.8 |
| Flammability | HB |
| Radiation resistance | Good |
| Refractive index | 1.59-1.6 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 19 |
| Water absorption - over 24 hours( % ) | 0.4 |
| Density( gcm⁻³ ) | 1.05 |
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Fair-Poor |
| Acids - dilute | Good-Fair |
| Alcohols | Good-Fair |
| Alkalis | Good-Fair |
| Aromatic hydrocarbons | Poor |
| Greases and Oils | Good-Poor |
| Halogenated Hydrocarbons | Poor |
| Halogens | Poor |
| Ketones | Poor |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 2.4-3.1 |
| Dissipation factor @ 1kHz | 0.0002 |
| Dielectric strength( kV mm⁻¹ ) | 20 |
| Volume resistivity( Ohmcm ) | >10¹⁶ |
Mechanical Properties
| Element | Value |
|---|---|
| Hardness - Rockwell | M60-90 |
| Poisson's ratio | 0.35 |
| Elongation at break( % ) | 1.6 |
| Tensile modulus( GPa ) | 2.3-4.1 |
| Izod impact strength( J m⁻¹ ) | 19-24 |
| Tensile strength( MPa ) | 30-100 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 0.45MPa( C ) | 90 |
| Heat-deflection temperature - 1.8MPa( C ) | 80 |
| Upper working temperature( C ) | 50-95 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1200 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.13@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 30-210 |
Other Customers Purchased
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Cross-Linked Polystyrene Rod Cross‑linked polystyrene rod provides rigidity, chemical stability, and thermal resistance for insulating supports, chemically resistant fixtures, precision tooling, and research on cross‑linked polymer mechanics, fatigue resistance, and composite reinforcement studies.each
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Vespel® SP1 Polyimide Film Vespel SP1 polyimide film with thermal stability, strength, and chemical resistance for seals, insulators, NMR hardware, metrology fixtures, and aerospace parts.each
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Nickel/Iron/Molybdenum Alloy Foil (Ni80/Fe15.5/Mo4.5) Nickel‑iron molybdenum alloy foil (Ni80/Fe15.5/Mo4.5) offers soft magnetic performance, low coercivity, and thermal stability for shielding, transformer laminations, and precision circuits.each
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Nickel/Iron/Molybdenum Alloy Foil (Light Tight) (Ni80/Fe15.5/Mo4.5) Nickel‑iron molybdenum alloy foil (light tight) (Ni80/Fe15.5/Mo4.5) provides pinhole‑free optical blocking and soft magnetic behavior for shielding, apertures, and precision enclosures.each
Starting at $369.00
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Titanium Dioxide Sheet Titanium dioxide sheet with high refractive index, chemical stability, and UV‑blocking in dense form for optical windows, photocatalytic panels, and solar reflectors.each
Starting at $690.00
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Polystyrene Granules Polystyrene granules provide rigidity, transparency, and mouldability for packaging, lab containers, petri dishes, and research on thermal processing, entanglement dynamics, and mechanical‑property tuning through additive strategies.each
Starting at $244.00
Discounts applied for volume purchases
