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Grade: Vespel® SP1
Formula: PI
Form: Foil/Film/Sheet
Material: Polyimide (PI)
CAS Number: 60842-76-4
Commodity: Polymers

Vespel® SP1 PI Film

Vespel® SP1 polyimide (PI) Film is a high-performance material known for its thermal stability (up to 300°C), mechanical strength, and chemical resistance. It is used in aerospace, automotive, and electronics applications to form seals, gaskets, and electrical insulators. This film withstands extreme temperatures and harsh environments, maintaining structural integrity under stress, making it attractive for demanding engineering and research applications. It is ideal for applications in space systems and high-performance electronics, where durable materials are used for long-term operation. In laboratories, Vespel® SP1 is used in NMR probe assemblies for non-RF components due to its magnetic neutrality and vacuum compatibility. In metrology, its low coefficient of thermal expansion (CTE) and creep resistance make it ideal for interferometer stages and coordinate measuring machine (CMM) fixtures.
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Tolerances

Foil/Film/Sheet
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Mechanical Properties
Electrical Properties
Physical Properties
Thermal Properties
Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 02-Mar
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 22
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60

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