Silver/Copper Alloy Foil (Light Tight) (AG95/Cu5)

Formula: Ag 95/Cu 5

Form: Foil (Light Tight)

Material: Silver/Copper Alloy

Commodity: Alloys

Light Tight: Light Tight

Goodfellow's range of foils includes Silver/Copper Alloy Foil (Light Tight) (AG95/Cu5), a foil composed of 95% silver and 5% copper. This alloy foil exhibits high electrical and thermal conductivity as well as excellent ductility. Applications of this silver/copper alloy foil include use as a reflective surface in scientific optics equipment and as an electromagnetic interference shielding material in electronics. With its optimized set of properties, this foil demonstrates the capabilities of materials in Goodfellow's foil inventory.

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Material Properties for Alloys

Mechanical Properties

Element	Value
Hardness - Brinell	0
Hardness - Rockwell	0
Elongation at break( % )	0
Modulus of elasticity( GPa )	0
Tensile modulus( GPa )	0
Izod impact strength( J m⁻¹ )	0
Hardness - Vickers( kgf mm⁻² )	0
Shear strength( MPa )	0
Tensile strength( MPa )	0

Magnetic Properties

Element	Value
Initial permeability	0
Maximum permeability	0
Coercivity (Hc)( A m⁻¹ )	0
Curie temperature( C )	0
Remanence from saturation (Brem)( T )	0
Saturation flux density( T )	0
Saturation Induction( T )	0

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	0
Temperature coefficient( K⁻¹ )	0

Thermal Properties

Element	Value
Crystallisation temperature( C )	0
Maximum use temperature in air( C )	0
Melting point( C )	0
Temperature - Austenitic( C )	0
Temperature - Martensitic( C )	0
Specific heat( J K⁻¹ kg⁻¹ )	0
Thermal conductivity( W m⁻¹ K⁻¹ )	0
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	0

Physical Properties

Element	Value
Density( gcm⁻³ )	0

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Silver/Copper Alloy Foil (Light Tight) (AG95/Cu5)

Material Properties for Alloys