C-Solder® Foil (Light Tight) (Sn Based)

Our C-Solder® Foil (Light Tight) (Sn Based) range offers a series of lead-free solder foils designed for electronics assembly and packaging applications. Available in 3 thicknesses, from 25 to 100 microns, this high-purity tin/copper/silver alloy foil offers excellent wetting and fatigue resistance. With its low melting point of around 227°C, it enables lead-free soldering processes while minimizing component warpage. This makes C-Solder® Foil (Light Tight) (Sn Based) ideal for creating reliable solder joints in temperature-sensitive microelectronics and optoelectronics packaging.

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