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Grade: DuPont™ Kapton® HPP-ST
Formula: PI
Form: Foil
Material: PI
CAS Number: 60842-76-4
Commodity: Polymers
Thickness:
0.125mm
DuPont™ Kapton® HPP-ST PI films is a high-performance polyimide film available in 11 variations. It’s valued for properties such as high dielectric strength, thermal stability and chemical resistance. This versatile polyimide film is used in applications including flexible printed circuits, wire and cable insulation, and as a high-temperature adhesive tape. With its impressive combination of electrical, thermal and chemical properties, Kapton® HPP-ST enables innovative solutions across a wide range of industries..
Tolerances
Foil
| Thickness | ±20% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Poor |
| Acids - dilute | Fair |
| Alcohols | Poor |
| Alkalis | Poor |
| Aromatic hydrocarbons | Good |
| Greases and Oils | Good |
| Halogenated Hydrocarbons | Good |
| Halogens | Fair |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.42 |
| Hardness - Rockwell | E52-99 |
| Elongation at break( % ) | Aug-70 |
| Tensile modulus( GPa ) | 02-Mar |
| Izod impact strength( J m⁻¹ ) | 80 |
| Tensile strength( MPa ) | 70-150 |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 3.4 |
| Dissipation factor @ 1kHz | 0.0018 |
| Dielectric strength( kV mm⁻¹ ) | 22 |
| Surface resistivity( Ohm/sq ) | 10¹⁶ |
| Volume resistivity( Ohmcm ) | 10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | V0 |
| Radiation resistance | Good |
| Refractive index | 1.66 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 53 |
| Water absorption - over 24 hours( % ) | 0.2-2.9 |
| Density( gcm⁻³ ) | 1.42 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 1.8MPa( C ) | 360 |
| Lower working temperature( C ) | -270 |
| Upper working temperature( C ) | 250-320 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1090 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.35@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 30-60 |
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