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Formula: Te
Form: Sputtering Target
Material: Tellurium
CAS Number: 13494-80-9
Commodity: Metals
Thickness: 3mm
Diameter: 50mm
Hazard Pictogram: GHS06,GHS08
Tellurium Sputtering Targets are high purity thin disks for use in vacuum deposition processes such as sputtering. Made from tellurium, they exhibit properties such as a narrow bandgap, high refractive index and photoconductivity. Applications include thermoelectric devices, solar cells and rewritable optical data storage media. With high purity and precision tolerances, these sputtering target disks allow you to reliably deposit uniform thin films of tellurium for quality results every time.
Technical Data Sheet Safety Data Sheet Tolerance Properties

Acute toxicity

Serious health hazard

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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 52
Crystal structure Hexagonal
Electronic structure Kr 4d¹⁰ 5s² 5p⁴
Valences shown 2,4,6
Atomic weight( amu ) 127.6
Thermal neutron absorption cross-section( Barns ) 4.7
Photo-electric work function( eV ) 4.8
Natural isotope distribution( Mass No./% ) 124/ 4.6
Natural isotope distribution( Mass No./% ) 125/ 7.0
Natural isotope distribution( Mass No./% ) 123/ 0.9
Natural isotope distribution( Mass No./% ) 126/ 18.7
Natural isotope distribution( Mass No./% ) 120/ 0.1
Natural isotope distribution( Mass No./% ) 128/ 31.7
Natural isotope distribution( Mass No./% ) 122/ 2.5
Natural isotope distribution( Mass No./% ) 130/ 34.5
Atomic radius - Goldschmidt( nm ) 0.143
Ionisation potential( No./eV ) 3/ 28.0
Ionisation potential( No./eV ) 4/ 37.4
Ionisation potential( No./eV ) 1/ 9.01
Ionisation potential( No./eV ) 6/ 70.7
Ionisation potential( No./eV ) 5/ 58.8
Ionisation potential( No./eV ) 2/ 18.6
Mechanical Properties
Element Value
Hardness - Mohs 2.3
Material condition Polycrystalline
Poisson's ratio 0.16-0.3
Bulk modulus( GPa ) 31.4
Tensile modulus( GPa ) 47.1
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 1.6x10⁵@0@0°C
Physical Properties
Element Value
Boiling point( C ) 990
Density( gcm⁻³ ) 6.25@20°C
Thermal Properties
Element Value
Melting point( C ) 450
Latent heat of evaporation( J g⁻¹ ) 820
Latent heat of fusion( J g⁻¹ ) 138
Specific heat( J K⁻¹ kg⁻¹ ) 201@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 3.3@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 16.75@0-100°C

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