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DuPont™ Kapton® HPP-ST PI Film

DuPont™ Kapton® HPP-ST PI films is a high-performance polyimide film available in 11 variations. It’s valued for properties such as high dielectric strength, thermal stability and chemical resistance. This versatile polyimide film is used in applications including flexible printed circuits, wire and cable insulation, and as a high-temperature adhesive tape. With its impressive combination of electrical, thermal and chemical properties, Kapton® HPP-ST enables innovative solutions across a wide range of industries..
Grade: DuPont™ Kapton® HPP-ST
Formula: PI
Thickness: 0.125mm
Length 1: 50mm
Length 2: 50mm
CAS Number: 60842-76-4
UOM Code: 281-907-67
SKU: 1000118975
Product Code: IM30-FM-000149

Tolerances

Foil/Film/Sheet
Thickness ±20%

Tolerances

Foil/Film/Sheet
Thickness ±20%
Technical Data Sheet
Safety Data Sheet
£198.13
each
  • Buy 5 for £160.48 each and save 19%
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Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 02-Mar
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 22
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60
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