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Formula: In
Form: Foil/Film/Sheet
Material: Indium
CAS Number: 7440-74-6
Commodity: Metals
Indium Foil is a high-purity, flexible material with excellent electrical and thermal conductivity, making it ideal for precise scientific applications. It is commonly used in semiconductor research, where it forms low-resistance electrical contacts in devices such as diodes and transistors. In thin-film deposition processes, indium foil serves as a target material for sputtering. Its low melting point (156°C) makes it suitable for soldering in electronics, especially for components requiring reliable bonding at low temperatures. Indium foil is also essential in cryogenics and low-temperature physics experiments, where it’s used in heat exchangers and thermoelectric devices. With its corrosion resistance and stable performance, indium foil from Goodfellow plays a crucial role in advancing research in optoelectronics, sensors, energy storage systems, and other cutting-edge applications in R&D laboratories.
Read moreTolerances
Foil/Film/Sheet
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 49 |
| Crystal structure | Face centred tetragonal |
| Electronic structure | Kr 4d¹⁰ 5s² 5p¹ |
| Valences shown | 1, 2, 3 |
| Atomic weight( amu ) | 114.82 |
| Thermal neutron absorption cross-section( Barns ) | 194 |
| Photo-electric work function( eV ) | 4.12 |
| Natural isotope distribution( Mass No./% ) | 113/ 4.3 |
| Natural isotope distribution( Mass No./% ) | 115/ 95.7 |
| Atomic radius - Goldschmidt( nm ) | 0.157 |
| Ionisation potential( No./eV ) | 3/ 28.0 |
| Ionisation potential( No./eV ) | Apr-54 |
| Ionisation potential( No./eV ) | 2/ 18.9 |
| Ionisation potential( No./eV ) | 1/ 5.79 |
Mechanical Properties
| Element | Value |
|---|---|
| Material condition | Polycrystalline |
| Material condition | Soft |
| Poisson's ratio | 0.45 |
| Poisson's ratio | 0.45 |
| Bulk modulus( GPa ) | 35.3 |
| Bulk modulus( GPa ) | 35.3 |
| Tensile modulus( GPa ) | 10.6 |
| Tensile modulus( GPa ) | 10.6 |
| Hardness - Vickers( kgf mm⁻² ) | 10 |
| Tensile strength( MPa ) | 2.6-4.5 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 8.8@20@20°C |
| Superconductivity critical temperature( K ) | 3.41 |
| Temperature coefficient( K⁻¹ ) | 0.0052@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.69 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 2080 |
| Density( gcm⁻³ ) | 7.3@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 156.6 |
| Latent heat of evaporation( J g⁻¹ ) | 2024 |
| Latent heat of fusion( J g⁻¹ ) | 28.5 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 234@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 81.8@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 24.8@0-100°C |
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