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Formula: Cu
Form: Thin Film
Material: Copper
CAS Number: 7440-50-8
Commodity: Metals
Purity:
99.99%
Copper Thin Film Disk is part of Goodfellow's range of thin films, with 32 variations available. The thin film copper disks feature properties such as high thermal and electrical conductivity, ductility, and corrosion resistance. Potential applications include use as electrodes in electronics, thermal management layers, reflective coatings, and EMI shielding.
Tolerances
Thin Film
| Thickness | ±30% |
|---|
Disk
| Diameter | ±20% |
|---|
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 29 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d¹⁰ 4s¹ |
| Valences shown | 1, 2 |
| Atomic weight( amu ) | 63.546 |
| Thermal neutron absorption cross-section( Barns ) | 3.8 |
| Photo-electric work function( eV ) | 4.5 |
| Natural isotope distribution( Mass No./% ) | 65/ 30.8 |
| Natural isotope distribution( Mass No./% ) | 63/ 69.2 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 4/ 55.2 |
| Ionisation potential( No./eV ) | 6/ 103 |
| Ionisation potential( No./eV ) | 1/ 7.73 |
| Ionisation potential( No./eV ) | 5/ 79.9 |
| Ionisation potential( No./eV ) | 3/ 36.8 |
| Ionisation potential( No./eV ) | 2/ 20.29 |
Mechanical Properties
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.343 |
| Poisson's ratio | 0.343 |
| Bulk modulus( GPa ) | 137.8 |
| Bulk modulus( GPa ) | 137.8 |
| Tensile modulus( GPa ) | 129.8 |
| Tensile modulus( GPa ) | 129.8 |
| Izod toughness( J m⁻¹ ) | 68 |
| Izod toughness( J m⁻¹ ) | 58 |
| Hardness - Vickers( kgf mm⁻² ) | 87 |
| Hardness - Vickers( kgf mm⁻² ) | 49 |
| Tensile strength( MPa ) | 314 |
| Tensile strength( MPa ) | 224 |
| Yield strength( MPa ) | 270 |
| Yield strength( MPa ) | 54 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 1.69@20@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0043@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.76 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 2567 |
| Density( gcm⁻³ ) | 8.96@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 1083 |
| Latent heat of evaporation( J g⁻¹ ) | 4796 |
| Latent heat of fusion( J g⁻¹ ) | 205 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 385@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 401@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@0-100°C |
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Thickness: 0.25µm
Length 1: 25mm
Length 2: 25mm
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Support: Permanent Polyester 25.4µm
CAS Number: 7440-05-3
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Thickness: 0.5µm
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Percentage Purity: 99.9%
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Percentage Purity: 99.9%
Thickness: 1µm
Length 1: 25mm
Length 2: 25mm
Area Density: 174µg/cm²
Support: Aluminium 6µm
CAS Number: 7439-95-4
UOM Code: 860-501-99
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Molybdenum Thin Film Disk Formula: Mo
Percentage Purity: 99.9%
Thickness: 0.1µm
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