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Formula: Cu
Form: Sputtering Target
Material: Copper
CAS Number: 7440-50-8
Commodity: Metals
Copper Sputtering Targets are are disks made from high purity copper that can be used as a target material for sputter deposition, a technique for applying thin films to substrates. We offer 8 variations of this product with different diameters and thicknesses to suit different deposition systems and desired film properties. Copper films deposited by sputtering have applications in microelectronics, optics and protective coatings.
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 29 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d¹⁰ 4s¹ |
| Valences shown | 1, 2 |
| Atomic weight( amu ) | 63.546 |
| Thermal neutron absorption cross-section( Barns ) | 3.8 |
| Photo-electric work function( eV ) | 4.5 |
| Natural isotope distribution( Mass No./% ) | 65/ 30.8 |
| Natural isotope distribution( Mass No./% ) | 63/ 69.2 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 4/ 55.2 |
| Ionisation potential( No./eV ) | 6/ 103 |
| Ionisation potential( No./eV ) | 1/ 7.73 |
| Ionisation potential( No./eV ) | 5/ 79.9 |
| Ionisation potential( No./eV ) | 3/ 36.8 |
| Ionisation potential( No./eV ) | 2/ 20.29 |
Mechanical Properties
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.343 |
| Poisson's ratio | 0.343 |
| Bulk modulus( GPa ) | 137.8 |
| Bulk modulus( GPa ) | 137.8 |
| Tensile modulus( GPa ) | 129.8 |
| Tensile modulus( GPa ) | 129.8 |
| Izod toughness( J m⁻¹ ) | 68 |
| Izod toughness( J m⁻¹ ) | 58 |
| Hardness - Vickers( kgf mm⁻² ) | 87 |
| Hardness - Vickers( kgf mm⁻² ) | 49 |
| Tensile strength( MPa ) | 314 |
| Tensile strength( MPa ) | 224 |
| Yield strength( MPa ) | 270 |
| Yield strength( MPa ) | 54 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 1.69@20@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0043@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.76 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 2567 |
| Density( gcm⁻³ ) | 8.96@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 1083 |
| Latent heat of evaporation( J g⁻¹ ) | 4796 |
| Latent heat of fusion( J g⁻¹ ) | 205 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 385@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 401@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@0-100°C |
Other Customers Purchased
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Copper Powder Formula: Cu
Percentage Purity: 99.99%
Maximum Particle Size: 800µm
Weight: 10g
CAS Number: 7440-50-8
UOM Code: 819-024-59
eachStarting at £163.95
Discounts applied for volume purchases -
Cu-DHP Alloy Foil (Cu - DHP) Formula: Cu - DHP
Temper: Soft
Thickness: 0.55mm
Length 1: 25mm
Length 2: 25mm
Surface Finish: Mirror polished on one side
UOM Code: 040-884-60
eachStarting at £0.00
Discounts applied for volume purchases
