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Additive Free Polymer PS Disk

Grade: Additive Free Polymer
Formula: PS
Form: Disk
Material: Polystyrene (PS)
Commodity: Polymers
Thickness: 0.05mm
Structure: Biaxially Oriented
Transparency: Clear/Transparent
The Additive Free Polymer PS Disk from Goodfellow is a versatile product available in 4 variations. As an amorphous thermoplastic, polystyrene offers excellent insulation properties, chemical resistance and ease of processing. The disks can be customized for size and thickness to suit applications like spacers, washers, and substrates in research and industrial settings. With no additives, the polymer maintains purity for use in analytical chemistry and calibration. Goodfellow's range of polystyrene disks offers scientists and engineers an ideal material for prototyping and small-scale production.
Technical Data Sheet Safety Data Sheet Tolerance Properties
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Tolerances

Disk
Thickness ±20%

Material Properties for Polymers

Physical Properties
Element Value
Abbe number 30.8
Flammability HB
Radiation resistance Good
Refractive index 1.59-1.6
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 19
Water absorption - over 24 hours( % ) 0.4
Density( gcm⁻³ ) 1.05
Chemical Resistance
Element Value
Acids - concentrated Fair-Poor
Acids - dilute Good-Fair
Alcohols Good-Fair
Alkalis Good-Fair
Aromatic hydrocarbons Poor
Greases and Oils Good-Poor
Halogenated Hydrocarbons Poor
Halogens Poor
Ketones Poor
Electrical Properties
Element Value
Dielectric constant @1MHz 2.4-3.1
Dissipation factor @ 1kHz 0.0002
Dielectric strength( kV mm⁻¹ ) 20
Volume resistivity( Ohmcm ) >10¹⁶
Mechanical Properties
Element Value
Hardness - Rockwell M60-90
Poisson's ratio 0.35
Elongation at break( % ) 1.6
Tensile modulus( GPa ) 2.3-4.1
Izod impact strength( J m⁻¹ ) 19-24
Tensile strength( MPa ) 30-100
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 90
Heat-deflection temperature - 1.8MPa( C ) 80
Upper working temperature( C ) 50-95
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-210

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