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Kapton® - Advanced Polyimide Films by DuPont
7 Grades Across 3 Forms. No Minimum Order. Free Global Delivery.
Goodfellow stocks the full DuPont Kapton® range — HN, FPC, HPP-ST, MT, B, CRC and 200RS100 — available to order in small research quantities or larger production volumes, with free global delivery and dispatch within 48 hours. Every grade is held in stock and available across multiple forms including film, coil and disk. Use the listings below to select your grade and configure your order, or if you're still determining which grade best fits your application, visit our Kapton® guide for a full property comparison, application breakdown, and grade selection support.
| Grade | Thermal | Electrical | Mechanical | Key Differentiator | Typical Applications | ||||
|---|---|---|---|---|---|---|---|---|---|
| Temp. Range | Thermal Cond. (W/m·K) |
Diel. Strength (kV/mm) |
Volume Res. (Ω·cm) |
Surface Treatment | Tensile Str. (MPa) |
Elongation (%) | Differentiator | Applications | |
| Kapton® HNGeneral purposeView product | −269 to +400 °C | 0.20 | 303 | 1.5×1017 | Untreated | 231 | 72 | Industry BaselineBalanced all-round properties; ASTM D-5213 reference grade | Aerospace wiring, cryogenics, microelectronics, flexible heaters, nuclear instrumentation |
| Kapton® FPCFlex circuitView product | −269 to +400 °C | 0.20 | 303 | 1.5×1017 | Double-sided adhesion treatment | 231 | 72 | Low ShrinkageIPC-4202/1 compliant; superior lay-flat and dimensional stability for fine-line copper | Flexible PCBs, rigid-flex circuits, high-density interconnects, wearable electronics |
| Kapton® HPP-STHigh stabilityView product | −269 to +400 °C | 0.20 | 303 | 1.5×1017 | Enhanced adhesion surface | 231 | 72 | Superior StabilityReduced CTE vs. HN; superior adhesion for lamination | Rigid-flex PCBs, satellite sensor encapsulation, space-qualified instrumentation |
| Kapton® MTThermal managementView product | −269 to +400 °C | 0.46 | ~216 | >1016 | Ceramic-filled (untreated) | ~138 | ~80 | 3× Thermal Cond.0.46 W/m·K — highest conductivity in the range; higher modulus, ceramic-filled | EV battery thermal interfaces, power electronics, LED substrates, motor slot insulation |
| Kapton® BMatte blackView product | −269 to +400 °C | 0.12 | ~110 | 1018 | Carbon black pigmented | ~241 | 65 | Light BlockingOpaque matte black finish; homogeneous pigmentation; higher tensile strength than HN | Optical baffles, shielded flex circuits, sensor insulation requiring light exclusion |
| Kapton® CRCCorona-resistantView product | −269 to +400 °C | 0.12 | 256 | >1016 | Untreated | 228 | 65 | Corona ResistantSignificantly higher voltage endurance than HN under partial discharge; greater thermal conductivity for winding heat dissipation | AC inverter-duty motors, rail & automotive traction motors, wind & hydro generators, transformers |
| Kapton® 200RS100Static dissipativeView product | −270 to +200 °C | 0.12 | >100 | — | Carbon coating (100 Ω/sq) | >100 | >40 | EMI / ESD ShieldConductive carbon coating; surface resistivity 100 Ω/sq; max +200 °C continuous (+325 °C short-term, O₂-free) | EMI shielding films, ESD-sensitive flex circuits, cleanroom packaging, antistatic insulation |
Kapton® HN
General purpose
Temp. Range−269 to +400 °C
Thermal Cond.0.20 W/m·K
Diel. Strength303 kV/mm
Volume Res.1.5×1017 Ω·cm
Tensile Str.231 MPa
Elongation72%
Key DifferentiatorIndustry Baseline Balanced all-round properties; ASTM D-5213 reference grade
ApplicationsAerospace wiring, cryogenics, microelectronics, flexible heaters, nuclear instrumentation
Kapton® FPC
Flex circuit
Temp. Range−269 to +400 °C
Thermal Cond.0.20 W/m·K
Diel. Strength303 kV/mm
Volume Res.1.5×1017 Ω·cm
Tensile Str.231 MPa
Elongation72%
Key DifferentiatorLow Shrinkage IPC-4202/1 compliant; superior lay-flat and dimensional stability
ApplicationsFlexible PCBs, rigid-flex circuits, high-density interconnects, wearable electronics
Kapton® HPP-ST
High stability
Temp. Range−269 to +400 °C
Thermal Cond.0.20 W/m·K
Diel. Strength303 kV/mm
Volume Res.1.5×1017 Ω·cm
Tensile Str.231 MPa
Elongation72%
Key DifferentiatorSuperior Stability Reduced CTE vs. HN; superior adhesion for lamination
ApplicationsRigid-flex PCBs, satellite sensor encapsulation, space-qualified instrumentation
Kapton® MT
Thermal management
Temp. Range−269 to +400 °C
Thermal Cond.0.46 W/m·K
Diel. Strength~216 kV/mm
Volume Res.>1016 Ω·cm
Tensile Str.~138 MPa
Elongation~80%
Key Differentiator3× Thermal Cond. 0.46 W/m·K — highest conductivity in the range; ceramic-filled
ApplicationsEV battery thermal interfaces, power electronics, LED substrates, motor slot insulation
Kapton® B
Matte black
Temp. Range−269 to +400 °C
Thermal Cond.0.12 W/m·K
Diel. Strength~110 kV/mm
Volume Res.1018 Ω·cm
Tensile Str.~241 MPa
Elongation65%
Key DifferentiatorLight Blocking Opaque matte black finish; homogeneous pigmentation; higher tensile strength than HN
ApplicationsOptical baffles, shielded flex circuits, sensor insulation requiring light exclusion
Kapton® CRC
Corona-Resistant
Temp. Range−269 to +400 °C
Thermal Cond.0.12 W/m·K
Diel. Strength256 kV/mm
Volume Res.>1016 Ω·cm
Tensile Str.228 MPa
Elongation65%
Key DifferentiatorCorona Resistant Greater thermal conductivity for winding heat dissipation
ApplicationsAC inverter-duty motors, rail & automotive traction motors, wind & hydro generators, transformers
Kapton® 200RS100
Static dissipative
Temp. Range−270 to +200 °C
Thermal Cond.0.12 W/m·K
Surface Res.~100 Ω/sq
Surface TreatmentCarbon coating
Tensile Str.>100 MPa
Elongation>40%
Key DifferentiatorEMI / ESD Shield Conductive carbon coating; 100 Ω/sq; max +200 °C continuous
ApplicationsEMI shielding films, ESD-sensitive flex circuits, cleanroom packaging, antistatic insulation
All grades comply with EU Directives 2015/863/EU (RoHS 3) and 2000/53/EC (ELV). Dielectric constant 3.4 @ 1 MHz; density 1.42 g/cm3 (all grades). Values are indicative — consult individual datasheets for specification-critical applications. †200RS100 density 1.46 g/cm³.