Tungsten/Copper Alloy Foil (W72/Cu28)

Tungsten Copper Alloy Foil (W72/Cu28) integrates 72% tungsten for superior arc resistance and mechanical strength with 28% copper for reliable thermal and electrical performance. This composition makes it ideal for high-power applications where thermal cycling and electrical conduction must coexist with structural integrity. Industries including aerospace, electronics, and defense employ W72/Cu28 foils in power switching devices, rocket nozzle liners, and high-frequency shielding foils. Specific applications include EDM electrodes, conductive shielding layers in high-vacuum systems, and arc-resistant foils in semiconductor fabrication. In research, W72/Cu28 foils are investigated for microstructural uniformity, thermal stress response, and arc erosion resistance. Their ability to maintain stability under extreme current loads while providing efficient conduction ensures long-term utility in aerospace propulsion, high-power electronics, and critical defense systems.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Foil

Thickness	<0.01mm	±25%
Thickness	0.01mm - 0.05mm	±25%
Thickness	>0.05mm	±10%

Material Properties for Alloys

Mechanical Properties

Element	Value
Hardness - Rockwell	92
Tensile strength( MPa )	600

Physical Properties

Element	Value
Density( gcm⁻³ )	14.4

Thermal Properties

Element	Value
Specific heat( J K⁻¹ kg⁻¹ )	210@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	198@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	10.2@20°C