Tungsten/Copper Alloy Foil (Light Tight) (W60/Cu40)

Tungsten Copper Alloy Foil Light Tight (W60/Cu40) combines tungsten’s density and high-temperature strength with copper’s conductivity, presented in a thin foil free of pinhole defects for superior integrity. The 60/40 composition balances toughness and conductivity, ensuring excellent electrical performance and thermal management while maintaining structural resilience. Industries including defense electronics, aerospace, and high-vacuum technology use this material where pinhole-free light shielding and conductivity are required. Specific applications include light-blocking seals in optical sensors, conductive foils for high-power vacuum electronics, and shielding in photonic devices. In research, W60/Cu40 light-tight foils are studied for microstructural stability, pinhole elimination, and performance under cyclic heating. Their unique ability to deliver pinhole-free, electrically conductive, and thermally stable performance ensures continued importance in next-generation aerospace, defense, and energy applications.

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Properties

Reference & Citations

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Material Properties for Alloys

Mechanical Properties

Element	Value
Hardness - Rockwell	82
Hardness - Vickers( kgf mm⁻² )	140
Tensile strength( MPa )	460

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	3.7
Temperature coefficient( K⁻¹ )	-

Physical Properties

Element	Value
Density( gcm⁻³ )	13

Thermal Properties

Element	Value
Specific heat( J K⁻¹ kg⁻¹ )	240@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	228@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	11.7@20°C