Heat Sealable - Minimum 130°C PP Disk
Grade: Heat Sealable - Minimum 130°C
Formula: PP
Thickness: 0.05mm
Diameter: 10mm
Structure: Biaxially Oriented
Transparency: Clear/Transparent
CAS Number: 9003-07-0
UOM Code: 243-590-44
Legacy Code: PP301351
Distributor Code: GF24359044
SKU: 1000103217
Product Code: PP30-FM-000151
Formula: PP
Thickness: 0.05mm
Diameter: 10mm
Structure: Biaxially Oriented
Transparency: Clear/Transparent
CAS Number: 9003-07-0
UOM Code: 243-590-44
Legacy Code: PP301351
Distributor Code: GF24359044
SKU: 1000103217
Product Code: PP30-FM-000151
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Good-Fair |
| Acids - dilute | Good-Fair |
| Alcohols | Good |
| Alkalis | Good |
| Aromatic hydrocarbons | Fair |
| Greases and Oils | Good-Fair |
| Halogenated Hydrocarbons | Good-Poor |
| Halogens | Poor |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.1-0.3 |
| Hardness - Rockwell | R80-100 |
| Elongation at break( % ) | 150-300, for biax film >50 |
| Tensile modulus( GPa ) | 0.9-1.5, for biax film 2.2-4.2 |
| Izod impact strength( J m⁻¹ ) | 20-100 |
| Abrasive resistance - ASTM D1044( mg/1000 cycles ) | 13-16 |
| Tensile strength( MPa ) | 25-40, for biax film 130-300, |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 2.2-2.6 |
| Dissipation factor @ 1MHz | 0.0003-0.0005 |
| Dielectric strength( kV mm⁻¹ ) | 30-40 |
| Surface resistivity( Ohm/sq ) | 10¹³ |
| Volume resistivity( Ohmcm ) | 10¹⁶-10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | HB |
| Radiation resistance | Fair |
| Refractive index | 1.49 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 18 |
| Water absorption - equilibrium( % ) | 0.03 |
| Density( gcm⁻³ ) | 0.9 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 0.45MPa( C ) | 100-105 |
| Heat-deflection temperature - 1.8MPa( C ) | 60-65 |
| Lower working temperature( C ) | 50 |
| Upper working temperature( C ) | 90-120 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1700-1900 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.22@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 100-180 |