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Silver Sputtering Target

Our Silver Sputtering Targets are designed for creating thin films of high purity (99.99%) silver. They’re available in 15 variations. Silver has excellent thermal and electrical conductivity as well as the highest reflectance of any metal. Applications for these disks include electronics, optics, semiconductors and solar cells, where their properties are utilized in metallization, electrical contacts, mirrors and reflective coatings.
Formula: Ag
Percentage Purity: 99.99%
Thickness: 6mm
Diameter: 50mm
CAS Number: 7440-22-4
UOM Code: 103-292-29
SKU: 1000007312
Product Code: AG00-ST-000300
Technical Data Sheet
Safety Data Sheet
$487.78
each
  • Buy 5 for $395.10 each and save 19%
  • Buy 10 for $360.96 each and save 26%
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Material Properties for Precious Metals

Atomic Properties
Element Value
Atomic number 47
Crystal structure Face centred cubic
Electronic structure Kr 4d¹⁰ 5s¹
Valences shown 1-2,2
Atomic weight( amu ) 107.8682
Thermal neutron absorption cross-section( Barns ) 63.8
Photo-electric work function( eV ) 4.7
Natural isotope distribution( Mass No./% ) 107/ 51.83
Natural isotope distribution( Mass No./% ) 109/ 48.17
Atomic radius - Goldschmidt( nm ) 0.144
Ionisation potential( No./eV ) 2/ 21.5
Ionisation potential( No./eV ) 1/ 7.58
Ionisation potential( No./eV ) 3/ 34.8
Mechanical Properties
Element Value
Material condition Hard
Material condition Soft
Poisson's ratio 0.367
Poisson's ratio 0.367
Bulk modulus( GPa ) 103.6
Bulk modulus( GPa ) 103.6
Tensile modulus( GPa ) 82.7
Tensile modulus( GPa ) 82.7
Izod toughness( J m⁻¹ ) 5
Hardness - Vickers( kgf mm⁻² ) 95
Hardness - Vickers( kgf mm⁻² ) 25
Tensile strength( MPa ) 330
Tensile strength( MPa ) 172
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 1.63@20@20°C
Temperature coefficient( K⁻¹ ) 0.0041@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.74
Physical Properties
Element Value
Boiling point( C ) 2212
Density( gcm⁻³ ) 10.5@20°C
Thermal Properties
Element Value
Melting point( C ) 961.9
Latent heat of evaporation( J g⁻¹ ) 2390
Latent heat of fusion( J g⁻¹ ) 103
Specific heat( J K⁻¹ kg⁻¹ ) 237@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 429@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 19.1@0-100°C
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