Silicon/Copper Alloy Powder (Si99/Cu1)

Silicon Copper Alloy Powder (Si99/Cu1) combines silicon’s semiconducting properties with copper’s electrical conductivity and ductility in a finely divided particulate form. This tailored composition enhances sintering behavior, oxidation resistance, and electrical stability, making it highly suited for conductive pastes, battery electrodes, and metallurgical additives. Industries such as electronics, additive manufacturing, and energy storage employ this alloy powder in printed circuit metallization, lithium-ion battery anodes, and high-performance solder formulations. Specific applications include conductive inks for flexible electronics, thermal interface composites, and precision 3D printing feedstocks, where its balance of electrical and mechanical traits is critical. Research focuses on optimizing silicon-copper interactions in nanostructures, exploring their role in microelectronic interconnects and catalytic systems. Its powder form ensures uniform dispersion and compositional control, reinforcing its importance in both scalable manufacturing and advanced research.