Tinned Copper (CuSn) Foil is a high-performance conductive material that combines the superior electrical and thermal conductivity of copper with the corrosion resistance and solderability of tin. Produced by applying a uniform tin layer onto a copper substrate, this foil is widely used in electrical, electronic, and shielding applications where durability, reliability, and ease of joining are essential (Koike & 小池健志, 2009).
Material Overview
Physically, tinned copper foil offers excellent abrasion resistance, thermal stability, and mechanical flexibility, enabling its use in high-performance electrical assemblies. The tin coating provides a smooth, uniform surface that enhances solderability and prevents oxidation of the underlying copper, ensuring consistent electrical contact quality. Chemically, the foil consists predominantly of copper with a thin, adherent tin layer that may form intermetallic phases such as Cu₆Sn₅ and Cu₃Sn, which contribute to improved bonding and corrosion protection (Choi et al., 2019).
The presence of tin significantly reduces the formation of copper oxides and whiskers, extending the material’s lifespan in harsh or humid environments. Its excellent formability and adhesion characteristics make it suitable for laminating, stamping, and other precision manufacturing processes used in advanced electronic systems.
Applications and Advantages
Electrical and electronic components. Tinned copper foil is commonly used in circuit boards, shielding layers, and flexible connectors due to its combination of conductivity, solderability, and corrosion resistance. Its stable contact resistance ensures long-term electrical performance even under elevated temperatures (Hara & 原利久, 2004).
EMI and RFI shielding. The foil’s high electrical conductivity and smooth surface make it ideal for electromagnetic and radio frequency interference shielding in cables, enclosures, and sensors. The tin layer also provides protection against environmental degradation in outdoor or industrial applications (Köhler et al., 2009).
Energy and industrial uses. In the energy sector, tinned copper foil is utilized in battery current collectors, grounding systems, and busbar fabrication. Its combination of strength, conductivity, and oxidation resistance allows it to maintain performance during repeated thermal cycling and mechanical stress (Dragomir et al., 2024).
Performance Benefits
- Excellent corrosion and oxidation resistance.
- High electrical and thermal conductivity.
- Superior solderability and bonding performance.
- Enhanced wear and insertion resistance.
- Reliable performance under thermal and mechanical stress.
Goodfellow Availability
Goodfellow supplies Tinned Copper (CuSn) Foil in a range of thicknesses and purities to suit laboratory, research, and industrial applications. The material is ideal for electronic shielding, electrical interconnects, and corrosion-resistant conductive surfaces.
Explore Tinned Copper (CuSn) Foil and related conductive materials in Goodfellow’s online catalogue: Goodfellow product finder.
References
- Koike, K., & 小池健志. (2009). Tinned Copper Alloy Bar with Excellent Abrasion Resistance, Insertion Properties, and Heat Resistance.
- Hara, T., & 原利久. (2004). Tinned Copper Alloy Material for Electrical/Electronic Components and Its Production Method.
- Köhler, M., Heide, A., Hojda, R., & Riepe, U. (2009). Copper–Tin Alloy, Composite Material and Use Thereof.
- Choi, J., Park, J., Kang, J., Frey, M. W., Oh, J.-W., & Kang, Y.-C. (2019). Investigation of Physicochemical Properties of CuSn-Based PAN Nanofibers Prepared via Electrospinning Method. Surface and Interface Analysis. https://doi.org/10.1002/SIA.6630
- Dragomir, F., Mănescu, T., & Tufiși, C. (2024). Influence of Copper–Iron (CuFe) and Copper–Tin (CuSn) Alloys over Mechanical Strength Properties in Crimping Process. Vibroengineering PROCEDIA. https://doi.org/10.21595/vp.2024.24508
- Tatsunori, N., & Masumitsu, S. (1992). Production of Tinned Copper Alloy Material Containing Zinc.