Tin/Antimony Alloy (Sn95/Sb5) is a binary metallic alloy consisting of approximately 95% tin and 5% antimony. This composition yields a material that combines high mechanical strength, good thermal and electrical conductivity, and excellent creep resistance, making it a widely used lead-free alloy in electronics, energy storage, and high-performance industrial applications (Schoeller et al., 2008).
Material Overview
Physically, Sn95/Sb5 exhibits a high tensile strength and modulus, coupled with superior resistance to deformation under long-term stress. These characteristics make it particularly effective in high-temperature and high-pressure environments such as deep well drilling sensors and electronic assemblies subjected to thermal cycling. The alloy’s hardness and thermal stability are largely influenced by the formation of intermetallic compounds, notably SbSn, which reinforce its microstructure and enhance mechanical strength (McCabe & Fine, 2002).
Chemically, the Sn–Sb system demonstrates excellent stability and oxidation resistance, with low electrical resistivity and strong metallurgical bonding properties. The addition of antimony modifies tin’s grain structure, improving both strength and creep performance without significantly compromising conductivity. Variations in alloying—such as the introduction of trace gold—can further refine its microstructure and improve reliability in microelectronic packaging (Kee et al., 2003). The alloy’s surface tension and viscosity are temperature-dependent, providing critical control in casting, soldering, and coating processes (Gancarz et al., 2013).
Applications and Advantages
Lead-free soldering and electronics. Sn95/Sb5 is a preferred choice in lead-free solder alloys, offering a strong, thermally stable alternative to traditional tin-lead solders. Its enhanced creep resistance and mechanical strength allow it to perform reliably in high-stress environments such as automotive electronics and microchip interconnects. The alloy’s stable microstructure ensures long service life in fluctuating thermal conditions (McCabe & Fine, 2002).
Energy storage and battery systems. Sn–Sb alloys are actively studied as anode materials in sodium-ion batteries, where their high theoretical capacity and good cycling stability support efficient energy storage. The Sn95/Sb5 composition, in particular, shows strong potential for maintaining high reversible capacity over multiple charge–discharge cycles (Gallawa et al., 2024).
Optoelectronics and conductive materials. Sn–Sb compounds are also utilized in P-type transparent conductive films, providing materials with both optical transparency and electrical conductivity suitable for photovoltaic cells and display technologies (Huo, 2007). Their combination of chemical stability and low defect density contributes to reliable performance in optoelectronic applications.
High-temperature industrial use. Due to its excellent creep and fatigue properties, Sn95/Sb5 finds applications in mechanical assemblies and sensors exposed to elevated temperatures and pressures. Its stable performance under prolonged stress conditions makes it an important material for high-reliability systems in energy, aerospace, and instrumentation.
Goodfellow Availability
Goodfellow supplies Tin/Antimony (Sn95/Sb5) alloys for scientific, electronic, and industrial applications requiring high mechanical strength, thermal stability, and lead-free composition. Available in various forms, including wires, foils, and ingots, Sn95/Sb5 is ideal for research, manufacturing, and advanced engineering applications.
Explore Tin/Antimony (Sn95/Sb5) and related lead-free alloys in Goodfellow’s online catalogue: Goodfellow product finder.
References
- Schoeller, H., Bansal, S., Knobloch, A. J., Shaddock, D., & Cho, J. (2008). Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn–5Sb. https://doi.org/10.1115/IMECE2008-68952
- Kee, S. B., Hussain, L. B., Khong, Y. L., & Kumar, D. C. P. (2003). Effects of Gold on the Properties of Tin–Antimony Solder in Flip-Chip Pin-Grid-Array Packages. https://doi.org/10.1109/EPTC.2003.1271494
- McCabe, R. J., & Fine, M. E. (2002). High Creep Resistance Tin-Based Alloys for Soldering Applications. Journal of Electronic Materials. https://doi.org/10.1007/S11664-002-0021-Y
- El-Bediwi, A. B., & Kashita, E. (2013). Effects of Alloying Elements on Physical Properties of Tin–Antimony Based Lead-Free Solder Alloys. Materials Science: An Indian Journal.
- Gallawa, J. R., Ma, J., & Prieto, A. L. (2024). Electrodeposition of Tin and Antimony-Based Anode Materials for Sodium-Ion Batteries. Journal of The Electrochemical Society. https://doi.org/10.1149/1945-7111/ad3854
- Huo, J. Z. (2007). Tin Antimony Oxide Film Material of P-Type Transparent Conduction and Manufacturing Method Thereof.
- Gancarz, T., Gąsior, W., & Henein, H. (2013). Physicochemical Properties of Sb, Sn, Zn, and Sb–Sn System. International Journal of Thermophysics. https://doi.org/10.1007/S10765-013-1407-1
- Gaver, C. C. (2005). Tin and Tin Alloys. https://doi.org/10.1002/0471238961.20091407012205.A01.PUB2
- Grund, S. C., Hanusch, K., Breunig, H. J., & Wolf, H. U. (2006). Antimony and Antimony Compounds. https://doi.org/10.1002/14356007.A03_055.PUB2
- Plevachuk, Yu., Sklyarchuk, V., Yakymovych, A., Švec, P., Janičkovič, D., & Illeková, E. (2011). Electrical Conductivity and Viscosity of Liquid Sn–Sb–Cu Alloys. Journal of Materials Science: Materials in Electronics. https://doi.org/10.1007/S10854-010-0188-6