Copper/Tellurium alloy (Cu99.5/Te0.5) is an advanced copper-based material engineered for superior machinability, electrical conductivity, and mechanical strength. Known for its microstructural stability and resistance to thermal degradation, this alloy is ideal for electrical contacts, semiconductor interconnects, and high-performance conductors.
Material Overview
Cu99.5/Te0.5 consists of 99.5 % copper alloyed with 0.5 % tellurium, which precipitates primarily as finely dispersed Cu2Te phases within a copper matrix. These microscopic precipitates strengthen the alloy through dispersion hardening while maintaining high electrical and thermal conductivities. Tellurium reduces grain boundary mobility, refining the microstructure during thermomechanical processing. Annealing studies show that the alloy’s electrical conductivity increases monotonically with temperature, reaching over 90 % IACS after recrystallization, while maintaining tensile strengths exceeding 300 MPa (Zhu et al., 2006). Continuous extrusion forming promotes dynamic recrystallization and precipitation, simultaneously enhancing ductility and conductivity in Cu–Te alloys (Shen et al., 2021).
Applications and Advantages
The Cu–Te system is extensively used in electronics, automotive, and aerospace industries for components that demand excellent electrical performance and wear resistance. Cu99.5/Te0.5’s balanced properties make it particularly useful in connector pins, switchgear, electrode holders, and thermoelectric modules. The tellurium addition significantly improves machinability—allowing clean, chip-free cuts—without introducing brittleness. Studies reveal that thermomechanically processed Cu–Te alloys exhibit enhanced ductility and conductivity, outperforming traditional copper–phosphorus or copper–beryllium alloys in terms of environmental safety and workability (Gorsse et al., 2023). Furthermore, precipitation of Cu2Te during annealing promotes microstructural uniformity, resulting in consistent performance under cyclic mechanical or thermal loading (Zhu et al., 2007).
Goodfellow Availability
Goodfellow provides Copper/Tellurium (Cu99.5/Te0.5) alloy in various forms, optimized for both research and industrial applications. Available with customizable dimensions and purities, this alloy ensures high electrical conductivity and durability for precision engineering and electronic fabrication.
Explore Copper/Tellurium Cu99.5/Te0.5 and other advanced materials in Goodfellow’s online catalogue: Goodfellow product finder.
References
- Shen, Z., Zhongze, L., Shi, P., Tang, G., Zheng, T., Liu, C., Guo, Y., & Zhong, Y. (2021). Enhanced strength, ductility and electrical conductivity of Cu–Te alloys via dynamic recrystallization and precipitation. Materials Science and Engineering A, 826, 141548. https://doi.org/10.1016/J.MSEA.2021.141548
- Zhu, D., Tang, K., Song, M., & Tu, M. (2006). Effects of annealing process on electrical conductivity and mechanical property of Cu–Te alloys. Transactions of Nonferrous Metals Society of China, 16(2), 378–382. https://doi.org/10.1016/S1003-6326(06)60078-2
- Zhu, D., Huang, W., Song, M., & Tu, M. (2007). Effects of annealing temperature on electrical conductivity and mechanical property of Cu–Te alloys. Journal of Wuhan University of Technology – Materials Science Edition, 22(1), 37–41. https://doi.org/10.1007/S11595-005-1088-0
- Gorsse, S., Gouné, M., Lin, W. C., & Girard, L. (2023). Dataset of mechanical properties and electrical conductivity of copper-based alloys. Scientific Data, 10, 463. https://doi.org/10.1038/s41597-023-02411-9
- Mansour, B., Mukhtar, F., & Barakati, G. G. (1986). Electrical and thermoelectric properties of copper tellurides. Physica Status Solidi (a), 95(2), 491–499. https://doi.org/10.1002/PSSA.2210950240