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PVDF-HFP Film

PVDF-HFP Film (Polyvinylidene Fluoride-Hexafluoropropylene) offers enhanced flexibility, chemical resistance, and electrochemical stability compared to standard PVDF, making it especially suited for membrane and battery applications. Its copolymer structure improves mechanical compliance without compromising chemical inertness, enabling use in lithium-ion battery separators, flexible fuel cell membranes, and protective barrier films. Specific applications include coating substrates for corrosion protection, creating stretchable dielectric layers, and producing chemically stable barrier membranes for harsh environments. In research, PVDF-HFP films are used to develop advanced electrolyte membranes, study polymer morphology under electrochemical cycling, and create high-performance piezoelectric and electroactive devices. The film format’s processability and superior mechanical resilience make it critical in next-generation energy and chemical systems.
Formula: FKM
Thickness: 5mm
Length 1: 100mm
Length 2: 100mm
Type: Non-conducting
Colour: Black
CAS Number: 9011-17-0
UOM Code: 937-148-71
Legacy Code: FV313400
Distributor Code:
GF93714871
SKU: 1000115811
Product Code: FV31-SH-000400

Tolerances

Foil/Film/Sheet
Thickness ±20%

Tolerances

Foil/Film/Sheet
Thickness ±20%
Technical Data Sheet
Safety Data Sheet
$357.00
each
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Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Fair
Acids - dilute Good
Alcohols Good-Fair
Alkalis Good-Fair
Aromatic hydrocarbons Good-Fair
Greases and Oils Good-Fair
Halogenated Hydrocarbons Good-Fair
Halogens Good
Ketones Poor
Physical Properties
Element Value
Flammability Self Extinguishing
Radiation resistance Poor
Resistance to Ultra-violet Excellent
Density( gcm⁻³ ) 2
Mechanical Properties
Element Value
Hardness - Rockwell Shore A75
Compression set after 24 hr at 175C( % ) 43
Elongation at break( % ) 200
Tensile strength( MPa ) 9
Tear strength( N mm⁻¹ ) 10
Thermal Properties
Element Value
Lower working temperature( C ) 40
Upper working temperature( C ) 220-300
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.2@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 160
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