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Technical Data Sheet
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PI Coil

The PI Coil is a high-performance polymer film product from Goodfellow's extensive range of specialty materials. Available in 23 variations, it offers outstanding heat resistance, chemical inertness and mechanical strength. These properties make polyimide film ideal for applications ranging from flexible printed circuits to insulation material in high-temperature environments. The different variations of Goodfellow's polyimide film enable engineers to select the optimal film properties and dimensions for their specific application requirements.
Formula: PI
Thickness: 0.05mm
Coil Width: 500mm
Length: 0.5m
UOM Code: 179-135-28
SKU: 1000067952
Product Code: IM30-FM-000101

Tolerances

Coil
Thickness ±20%

Tolerances

Coil
Thickness ±20%
Technical Data Sheet
Safety Data Sheet
$475.05
each
  • Buy 5 for $384.79 each and save 19%
  • Buy 10 for $351.53 each and save 26%
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Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 02-Mar
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 22
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60
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