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- About Us
Copper
Copper (Cu) is a reddish-brown metal renowned for its excellent electrical and thermal conductivity, second only to silver. It is highly ductile, malleable, and resistant to corrosion, making it a versatile material for applications in electronics, power transmission, microfabrication, and advanced scientific instrumentation. With a melting point of 1084 °C and an FCC crystal structure, copper exhibits good mechanical strength and is easily fabricated. It is also an essential material in catalysis, vacuum systems, cryogenics, and particle physics.
Goodfellow offers a vast selection of copper (Cu) products, including Copper Rods, Copper Sputtering Targets, and Copper Foils, designed for high-precision research and industrial use. Known for its excellent electrical and thermal conductivity, antimicrobial properties, as well as corrosion resistance, copper is essential in applications such as electronics, biomedical devices, energy storage, semiconductor fabrication, and materials science. Our copper-based solutions support ongoing laboratory research in advanced electronics, electromagnetic shielding, and nanotechnology, providing researchers with reliable materials for developing high-performance systems and components.
Properties
Identifiers
Isotopes
Applications
Grades
Synonyms
General Properties
| Property | Value |
|---|---|
| Atomic Number | 29 |
| Density | 8.96 g/cm³ |
| Melting Point | 1084 °C |
| Boiling Point | 2562 °C |
| Thermal Conductivity | 401 W/m·K |
| Electrical Resistivity | 16.8 nΩ·m |
| Crystal Structure | Face-Centered Cubic (FCC) |
Mechanical Properties
| Property | Value |
|---|---|
| Tensile Strength | 200–400 MPa (annealed to hard) |
| Yield Strength | 33–200 MPa |
| Young’s Modulus | 110–130 GPa |
| Hardness | Brinell 35–110 |
| Elongation at Break | 30–60% |
| Poisson’s Ratio | 0.34 |
Chemical Properties
| Property | Value |
|---|---|
| Corrosion Resistance | Good, forms stable oxide |
| Reactivity | Reacts with oxidizing agents, acids |
| Oxidation States | +1, +2 |
| Surface Oxide | Copper oxide (CuO, Cu₂O) |
| Identifier | Value |
|---|---|
| Symbol | Cu |
| Atomic Number | 29 |
| CAS Number | 7440-50-8 |
| UN Number | UN3089 (powder) |
| EINECS Number | 231-159-6 |
| Isotope | Type | Notes |
|---|---|---|
| Cu-63 | Stable | 69% natural abundance |
| Cu-65 | Stable | 31% natural abundance |
| Cu-67 | Radioactive | Used in cancer therapy research |
Scientific Applications
| Use Case | Description |
|---|---|
| Catalysis | Cu catalysts used in CO₂ reduction, hydrogenation |
| High Vacuum Systems | OFHC copper for UHV components |
| Particle Physics | Used in beamline and accelerator components |
| Heat Sinks | Excellent thermal transfer in lab and cryo systems |
Industrial Applications
| Use Case | Description |
|---|---|
| Electronics | Wiring, PCBs, connectors |
| HVAC and Heat Exchangers | Cu tubing and fins for thermal systems |
| Architecture | Roofing, decorative cladding |
| Power Transmission | Cables, busbars, windings |
| Microfabrication | Etching and patterning of Cu thin films |
| Property | Pure Copper | Grade 200 Copper | OFHC Copper | Cu-DHP |
|---|---|---|---|---|
| Copper Content | ≥99.99% | ≥99.9% | ≥99.99% (oxygen-free) | ≥99.9% |
| Oxygen Content | Varies | Low | <0.001% | ≤0.04% (with P) |
| Electrical Conductivity | Very High | High (IACS ~100%) | Very High (≥101% IACS) | High (≥85% IACS) |
| Thermal Conductivity | Excellent | High | Very High | Good |
| Applications | Research, UHV, targets | Electrical, general industrial | Vacuum tech, cryogenics | Plumbing, heat exchangers |
| Standards | — | ASTM B152, B170 | ASTM B170, B187 | EN CW024A / C12200 |
| Synonym |
|---|
| Cu |
| Electrolytic Copper |
| OFHC (Oxygen-Free High Conductivity) |
| Cu-DHP (Deoxidized High Phosphorus Copper) |
| Copper metal |