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Gold Sputtering Target

Gold Sputtering Targets are available in 80 size variations and fabricated from 99.99% pure gold with multiple grades available. They offer excellent thermal and electrical conductivity along with corrosion resistance. These disks enable deposition of uniform, high-quality gold thin films using sputter coating processes for applications such as electronics, optics and semiconductor device fabrication.
Formula: Au
Percentage Purity: 99.95%
Thickness: 0.5mm
Diameter: 25.4mm
CAS Number: 7440-57-5
UOM Code: 649-377-41
SKU: 1000032789
Product Code: AU00-ST-000103
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Material Properties for Precious Metals

Atomic Properties
Element Value
Atomic number 79
Crystal structure Face centred cubic
Electronic structure Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown 1,3
Atomic weight( amu ) 196.9665
Thermal neutron absorption cross-section( Barns ) 98.8
Photo-electric work function( eV ) 4.8
Atomic radius - Goldschmidt( nm ) 0.144
Ionisation potential( No./eV ) 1/ 9.22
Ionisation potential( No./eV ) 2/ 20.5
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.42
Poisson's ratio 0.42
Bulk modulus( GPa ) 171
Bulk modulus( GPa ) 171
Tensile modulus( GPa ) 78.5
Tensile modulus( GPa ) 78.5
Hardness - Vickers( kgf mm⁻² ) 20-30
Hardness - Vickers( kgf mm⁻² ) 60
Tensile strength( MPa ) 130
Tensile strength( MPa ) 220
Yield strength( MPa ) 205
Yield strength( MPa ) -
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 2.20@20@20°C
Temperature coefficient( K⁻¹ ) 0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.74
Physical Properties
Element Value
Boiling point( C ) 3080
Density( gcm⁻³ ) 19.3@20°C
Thermal Properties
Element Value
Melting point( C ) 1064.4
Latent heat of evaporation( J g⁻¹ ) 1738
Latent heat of fusion( J g⁻¹ ) 64.9
Specific heat( J K⁻¹ kg⁻¹ ) 129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 14.1@0-100°C
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