Gold Spooled Wire

Gold Spooled Wire provides electrical conductivity and chemical stability, making it suitable for microelectronic interconnects, microelectromechanical systems (MEMS), and medical implantable device fabrication. In laboratories, its resistance to oxidation and corrosion ensures long-term performance in sensitive environments such as vacuum systems and high-humidity chambers. The wire’s gauge control and purity support applications in flexible hybrid electronics (more commonly as sputtered films), chip bonding (particularly in high-reliability applications like aerospace and military), and photonic sensors (using thin gold films for precise control). Its ductility allows for ultrasonic and thermosonic bonding, making it a trusted material for precision engineering, semiconductor research and advanced device prototyping.

Formula: Au
Percentage Purity: 99.99%
Product Shape: Spooled
Diameter: 0.025mm
Length: 100m
Temper: Hard
CAS Number: 7440-57-5
UOM Code: 013-643-52
Legacy Code: AU005120
Distributor Code: GF01364352

SKU: 1000001747

Product Code: AU00-WR-000120

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Tolerances

Wire

Diameter		±10%
Length		+5% / -1%

Tolerances

Wire

Diameter		±10%
Length		+5% / -1%

Technical Data Sheet

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Safety Data Sheet

$1,582.28

each

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Material Properties for Precious Metals

Atomic Properties

Element	Value
Atomic number	79
Crystal structure	Face centred cubic
Electronic structure	Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown	1,3
Atomic weight( amu )	196.9665
Thermal neutron absorption cross-section( Barns )	98.8
Photo-electric work function( eV )	4.8
Atomic radius - Goldschmidt( nm )	0.144
Ionisation potential( No./eV )	1/ 9.22
Ionisation potential( No./eV )	2/ 20.5

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.42
Poisson's ratio	0.42
Bulk modulus( GPa )	171
Bulk modulus( GPa )	171
Tensile modulus( GPa )	78.5
Tensile modulus( GPa )	78.5
Hardness - Vickers( kgf mm⁻² )	20-30
Hardness - Vickers( kgf mm⁻² )	60
Tensile strength( MPa )	130
Tensile strength( MPa )	220
Yield strength( MPa )	205
Yield strength( MPa )	-

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	2.20@20@20°C
Temperature coefficient( K⁻¹ )	0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.74

Physical Properties

Element	Value
Boiling point( C )	3080
Density( gcm⁻³ )	19.3@20°C

Thermal Properties

Element	Value
Melting point( C )	1064.4
Latent heat of evaporation( J g⁻¹ )	1738
Latent heat of fusion( J g⁻¹ )	64.9
Specific heat( J K⁻¹ kg⁻¹ )	129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	14.1@0-100°C