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Copper Ultrafine Wire

Available Configurations

Properties common to all products in this list

Commodity: Metals Material: Copper Form: Wire Composition: Cu CAS Number: 7440-50-8 Purity: 99.95% (3N5) Temper: As Drawn
Diameter Length Other Variants
0.0015mm to 0.009mm 1m to 5m High-Purity; Oxygen-Free High-Conductivity

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Copper Ultrafine Wire provides 99.95% purity copper drawn to sub-millimetre diameters, combining copper's outstanding electrical conductivity (resistivity 1.69 µΩ·cm) with the mechanical flexibility and high surface-area-to-volume ratio that ultrafine dimensions uniquely enable. The fine gauge makes Copper Ultrafine Wire particularly well suited to current collector substrates in supercapacitors, where it supports high-capacitance active materials such as manganese dioxide across a large effective surface, and to flexible and stretchable electronics, where it maintains conductivity under repeated high-strain deformation. In microelectronics and MEMS fabrication, it serves as fine-pitch interconnect and miniature coil winding material where conventional wire gauges are impractical. For biomedical sensing applications, bare ultrafine copper wire is typically coated with parylene or a gold shell to suppress cytotoxicity, enabling integration into implantable sensors and neural probes while preserving its conductive core.
Starting at $830.00 each
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Key Features

Copper Ultrafine Wire provides 99.95% purity copper drawn to sub-millimetre diameters, combining outstanding electrical conductivity with the mechanical flexibility and high surface-area-to-volume ratio that ultrafine dimensions uniquely enable:

Outstanding Electrical Conductivity at Ultrafine Dimensions (1.69 µΩ·cm)

Copper Ultrafine Wire combines copper's electrical resistivity of 1.69 µΩ·cm with sub-millimetre gauge, delivering high conductivity in wire dimensions suited to fine-pitch interconnects, miniature coil windings, and current collector substrates where conventional wire gauges are too large for the application geometry.

High Surface-Area-to-Volume Ratio for Energy Storage

The ultrafine gauge provides a high surface-area-to-volume ratio that makes Copper Ultrafine Wire particularly well suited to current collector substrates in supercapacitors, where it supports high-capacitance active materials such as manganese dioxide across a large effective surface to maximise energy storage performance.

Mechanical Flexibility for High-Strain Applications

Copper Ultrafine Wire maintains conductivity under repeated high-strain deformation, making it suitable for flexible and stretchable electronics where conventional wire gauges would fracture under the bending and stretching cycles encountered in wearable and conformable device applications.

Suited to Microelectronics & MEMS Fabrication

At sub-millimetre diameters, Copper Ultrafine Wire serves as fine-pitch interconnect and miniature coil winding material in microelectronics and MEMS fabrication, where the wire dimensions allow integration into device geometries where conventional wire gauges are impractical.

Biomedical Compatibility via Coating

For biomedical sensing applications, bare ultrafine copper wire is typically coated with parylene or a gold shell to suppress cytotoxicity, enabling integration into implantable sensors and neural probes while preserving the conductive copper core — combining the electrical performance of copper with the biocompatibility required for prolonged contact with biological tissue.

Industrial Applications

Copper ultrafine wire (sub‑millimetre diameters) is used in energy storage, flexible electronics, microelectronics, and biomedical applications where smaller wire dimensions enable form factors and interconnects that conventional gauges cannot.

Supercapacitor Current Collector Substrates
Can be used as current‑collector substrates in supercapacitors: the high surface‑area‑to‑volume ratio of ultrafine wire (for example, in woven or nonwoven meshes) can increase the effective contact area for high‑capacitance active materials such as manganese dioxide, helping to improve charge‑storage density in compact device geometries. Practical performance depends on integration details (wire mesh/foam geometry, contact resistance, coating/binder methods, electrolyte access and mechanical durability), so ultrafine‑wire collectors are typically considered alongside foils, foams, and engineered meshes rather than as a universal replacement.
Flexible & Stretchable Electronics
Employed in flexible and stretchable electronic devices where Copper Ultrafine Wire maintains conductivity under repeated high-strain deformation, enabling conductive pathways in wearable, conformable, and implantable device architectures where conventional wire gauges would fracture under the bending and stretching cycles of normal use.
Microelectronics & MEMS Fine-Pitch Interconnects
Serves as fine-pitch interconnect and miniature coil winding material in microelectronics and MEMS fabrication, where sub-millimetre dimensions allow integration into device geometries — sensors, actuators, and signal processing components — where conventional wire gauges are too large to be practically incorporated.
Implantable Sensors & Neural Probes
Used as the conductive core in implantable sensors and neural probes when coated with parylene or a gold shell to suppress cytotoxicity, combining the electrical resistivity of 1.69 µΩ·cm with the biocompatibility required for prolonged integration with biological tissue in sensing and stimulation devices.
Miniature Coil Windings
Applied as miniature coil winding material in microelectronics where the sub-millimetre gauge allows coils to be wound to geometries impractical with conventional wire, supporting compact inductive components in miniaturised sensors, actuators, and signal conditioning circuits.

Synonyms

Ultra-thin Copper Wire Copper Micro-Wire

Material Properties

Atomic Properties
Element Value
Atomic number 29
Crystal structure Face centred cubic
Electronic structure Ar 3d¹⁰ 4s¹
Valences shown 1, 2
Atomic weight( amu ) 63.546
Thermal neutron absorption cross-section( Barns ) 3.8
Photo-electric work function( eV ) 4.5
Natural isotope distribution( Mass No./% ) 65/ 30.8
Natural isotope distribution( Mass No./% ) 63/ 69.2
Atomic radius - Goldschmidt( nm ) 0.128
Ionisation potential( No./eV ) 4/ 55.2
Ionisation potential( No./eV ) 6/ 103
Ionisation potential( No./eV ) 1/ 7.73
Ionisation potential( No./eV ) 5/ 79.9
Ionisation potential( No./eV ) 3/ 36.8
Ionisation potential( No./eV ) 2/ 20.29
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.343
Poisson's ratio 0.343
Bulk modulus( GPa ) 137.8
Bulk modulus( GPa ) 137.8
Tensile modulus( GPa ) 129.8
Tensile modulus( GPa ) 129.8
Izod toughness( J m⁻¹ ) 68
Izod toughness( J m⁻¹ ) 58
Hardness - Vickers( kgf mm⁻² ) 87
Hardness - Vickers( kgf mm⁻² ) 49
Tensile strength( MPa ) 314
Tensile strength( MPa ) 224
Yield strength( MPa ) 270
Yield strength( MPa ) 54
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 1.69@20°C
Temperature coefficient( K⁻¹ ) 0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.76
Physical Properties
Element Value
Boiling point( C ) 2567
Density( gcm⁻³ ) 8.96@20°C
Thermal Properties
Element Value
Melting point( C ) 1083
Latent heat of evaporation( J g⁻¹ ) 4796
Latent heat of fusion( J g⁻¹ ) 205
Specific heat( J K⁻¹ kg⁻¹ ) 385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 17@0-100°C
each

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Available Configurations

Properties common to all products in this list

Commodity: Metals Material: Copper Form: Wire Composition: Cu CAS Number: 7440-50-8 Purity: 99.95% (3N5) Temper: As Drawn

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Tolerances

Wire
Diameter ±10%
Length +5% / -1%