Technical Data Sheet
Safety Data Sheet
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Copper Thin Film Disc

Copper Thin Film Disc is part of Goodfellow's range of thin films, with 32 variations available. The thin film copper discs feature properties such as high thermal and electrical conductivity, ductility, and corrosion resistance. Potential applications include use as electrodes in electronics, thermal management layers, reflective coatings, and EMI shielding. With numerous options, Goodfellow's copper Mylar discs enable customization for specialized research, engineering, and industrial uses.
Thickness: 0.25µm
Support: Permanent Mylar® 3.5µm
Area Density: 219.9µg/cm²
Diameter: 10mm
Technical Name: Copper
Formula: Cu
Percentage Purity: 99.99%
Density: 8.96g/cm³
CAS Number: 7440-50-8
UOM Code: 414-075-01
SKU: 1000051449
Product Code: CU00-MF-000200

Tolerances

Thin Film
Thickness ±30%
Disc
Diameter ±20%
No Minimum order Approx. 2 weeks leadtime Free technical support *Free delivery worldwide
$603.36
each
  • Buy 5 for $488.72 each and save 19%
  • Buy 10 for $446.49 each and save 26%

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Tolerances

Thin Film
Thickness ±30%
Disc
Diameter ±20%
Technical Data Sheet
Safety Data Sheet

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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 29
Crystal structure Face centred cubic
Electronic structure Ar 3d¹⁰ 4s¹
Valences shown 1, 2
Atomic weight( amu ) 63.546
Thermal neutron absorption cross-section( Barns ) 3.8
Photo-electric work function( eV ) 4.5
Natural isotope distribution( Mass No./% ) 65/ 30.8
Natural isotope distribution( Mass No./% ) 63/ 69.2
Atomic radius - Goldschmidt( nm ) 0.128
Ionisation potential( No./eV ) 4/ 55.2
Ionisation potential( No./eV ) 6/ 103
Ionisation potential( No./eV ) 1/ 7.73
Ionisation potential( No./eV ) 5/ 79.9
Ionisation potential( No./eV ) 3/ 36.8
Ionisation potential( No./eV ) 2/ 20.29
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.343
Poisson's ratio 0.343
Bulk modulus( GPa ) 137.8
Bulk modulus( GPa ) 137.8
Tensile modulus( GPa ) 129.8
Tensile modulus( GPa ) 129.8
Izod toughness( J m⁻¹ ) 68
Izod toughness( J m⁻¹ ) 58
Hardness - Vickers( kgf mm⁻² ) 87
Hardness - Vickers( kgf mm⁻² ) 49
Tensile strength( MPa ) 314
Tensile strength( MPa ) 224
Yield strength( MPa ) 270
Yield strength( MPa ) 54
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 1.69@20@20°C
Temperature coefficient( K⁻¹ ) 0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.76
Physical Properties
Element Value
Boiling point( C ) 2567
Density( gcm⁻³ ) 8.96@20°C
Thermal Properties
Element Value
Melting point( C ) 1083
Latent heat of evaporation( J g⁻¹ ) 4796
Latent heat of fusion( J g⁻¹ ) 205
Specific heat( J K⁻¹ kg⁻¹ ) 385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 17@0-100°C
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