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Copper Thin Film Disk
Copper Thin Film Disk is part of Goodfellow's range of thin films, with 32 variations available. The thin film copper disks feature properties such as high thermal and electrical conductivity, ductility, and corrosion resistance. Potential applications include use as electrodes in electronics, thermal management layers, reflective coatings, and EMI shielding.
Formula: Cu
Percentage Purity: 99.99%
Thickness: 0.25µm
Diameter: 10mm
Area Density: 219.9µg/cm²
Support: Permanent Mylar® 3.5µm
CAS Number: 7440-50-8
UOM Code: 414-075-01
Legacy Code: CU004600
Distributor Code: GF41407501
Percentage Purity: 99.99%
Thickness: 0.25µm
Diameter: 10mm
Area Density: 219.9µg/cm²
Support: Permanent Mylar® 3.5µm
CAS Number: 7440-50-8
UOM Code: 414-075-01
Legacy Code: CU004600
Distributor Code: GF41407501
SKU: 1000051449
Product Code: CU00-MF-000200
Tolerances
Thin Film
| Thickness | ±30% |
|---|
Disk
| Diameter | ±20% |
|---|
Tolerances
Thin Film
| Thickness | ±30% |
|---|
Disk
| Diameter | ±20% |
|---|
$616.63
each
- Buy 5 for $499.47 each and save 19%
- Buy 10 for $456.31 each and save 26%
No Minimum order
Approx. 2 weeks leadtime
Free technical support
*Free delivery worldwide
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 29 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d¹⁰ 4s¹ |
| Valences shown | 1, 2 |
| Atomic weight( amu ) | 63.546 |
| Thermal neutron absorption cross-section( Barns ) | 3.8 |
| Photo-electric work function( eV ) | 4.5 |
| Natural isotope distribution( Mass No./% ) | 65/ 30.8 |
| Natural isotope distribution( Mass No./% ) | 63/ 69.2 |
| Atomic radius - Goldschmidt( nm ) | 0.128 |
| Ionisation potential( No./eV ) | 4/ 55.2 |
| Ionisation potential( No./eV ) | 6/ 103 |
| Ionisation potential( No./eV ) | 1/ 7.73 |
| Ionisation potential( No./eV ) | 5/ 79.9 |
| Ionisation potential( No./eV ) | 3/ 36.8 |
| Ionisation potential( No./eV ) | 2/ 20.29 |
Mechanical Properties
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.343 |
| Poisson's ratio | 0.343 |
| Bulk modulus( GPa ) | 137.8 |
| Bulk modulus( GPa ) | 137.8 |
| Tensile modulus( GPa ) | 129.8 |
| Tensile modulus( GPa ) | 129.8 |
| Izod toughness( J m⁻¹ ) | 68 |
| Izod toughness( J m⁻¹ ) | 58 |
| Hardness - Vickers( kgf mm⁻² ) | 87 |
| Hardness - Vickers( kgf mm⁻² ) | 49 |
| Tensile strength( MPa ) | 314 |
| Tensile strength( MPa ) | 224 |
| Yield strength( MPa ) | 270 |
| Yield strength( MPa ) | 54 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 1.69@20@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0043@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.76 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 2567 |
| Density( gcm⁻³ ) | 8.96@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 1083 |
| Latent heat of evaporation( J g⁻¹ ) | 4796 |
| Latent heat of fusion( J g⁻¹ ) | 205 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 385@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 401@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 17@0-100°C |
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