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Copper Sputtering Target
Copper Sputtering Target
Copper Sputtering Targets are are discs made from high purity copper that can be used as a target material for sputter deposition, a technique for applying thin films to substrates. We offer 8 variations of this product with different diameters and thicknesses to suit different deposition systems and desired film properties. Copper films deposited by sputtering have applications in microelectronics, optics and protective coatings.
Formula: CuPercentage Purity: 99.999%Thickness: 3mmDiameter: 25.4mmCAS Number: 7440-50-8UOM Code: 317-641-91
SKU : 1000052080
Product Code : CU00-ST-000101
Buy 5 for
$176.79
each and save 19 %
Buy 10 for
$161.51
each and save 26 %
No Minimum order
Despatch of products in stock within 48 hours
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*Free delivery worldwide
Material Properties for Metals
Atomic Properties
Element
Value
Atomic number
29
Crystal structure
Face centred cubic
Electronic structure
Ar 3d¹⁰ 4s¹
Valences shown
1, 2
Atomic weight( amu )
63.546
Thermal neutron absorption cross-section( Barns )
3.8
Photo-electric work function( eV )
4.5
Natural isotope distribution( Mass No./% )
65/ 30.8
Natural isotope distribution( Mass No./% )
63/ 69.2
Atomic radius - Goldschmidt( nm )
0.128
Ionisation potential( No./eV )
4/ 55.2
Ionisation potential( No./eV )
6/ 103
Ionisation potential( No./eV )
1/ 7.73
Ionisation potential( No./eV )
5/ 79.9
Ionisation potential( No./eV )
3/ 36.8
Ionisation potential( No./eV )
2/ 20.29
Mechanical Properties
Element
Value
Material condition
Soft
Material condition
Hard
Poisson's ratio
0.343
Poisson's ratio
0.343
Bulk modulus( GPa )
137.8
Bulk modulus( GPa )
137.8
Tensile modulus( GPa )
129.8
Tensile modulus( GPa )
129.8
Izod toughness( J m⁻¹ )
68
Izod toughness( J m⁻¹ )
58
Hardness - Vickers( kgf mm⁻² )
87
Hardness - Vickers( kgf mm⁻² )
49
Tensile strength( MPa )
314
Tensile strength( MPa )
224
Yield strength( MPa )
270
Yield strength( MPa )
54
Electrical Properties
Element
Value
Electrical resistivity( µOhmcm )
1.69@20@20°C
Temperature coefficient( K⁻¹ )
0.0043@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )
0.76
Physical Properties
Element
Value
Boiling point( C )
2567
Density( gcm⁻³ )
8.96@20°C
Thermal Properties
Element
Value
Melting point( C )
1083
Latent heat of evaporation( J g⁻¹ )
4796
Latent heat of fusion( J g⁻¹ )
205
Specific heat( J K⁻¹ kg⁻¹ )
385@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )
401@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )
17@0-100°C
Other Customers Purchased
Copper Sputtering Target
Formula: Cu
Percentage Purity: 99.99%
Thickness: 3mm
Diameter: 76.2mm
CAS Number: 7440-50-8
UOM Code: 878-485-11
Discounts applied for volume purchases
Copper Sputtering Target
Formula: Cu
Percentage Purity: 99.99%
Thickness: 3mm
Diameter: 75mm
CAS Number: 7440-50-8
UOM Code: 866-602-31
Discounts applied for volume purchases
Copper Sputtering Target
Formula: Cu
Percentage Purity: 99.99%
Thickness: 6mm
Diameter: 25mm
CAS Number: 7440-50-8
UOM Code: 409-363-61
Discounts applied for volume purchases
Copper Sputtering Target
Formula: Cu
Percentage Purity: 99.99%
Thickness: 3mm
Diameter: 25mm
CAS Number: 7440-50-8
UOM Code: 141-186-89
Discounts applied for volume purchases
Copper Sputtering Target
Formula: Cu
Percentage Purity: 99.99%
Thickness: 3mm
Diameter: 50mm
CAS Number: 7440-50-8
UOM Code: 550-932-82
Discounts applied for volume purchases
Copper Sputtering Target
Formula: Cu
Percentage Purity: 99.99%
Thickness: 6mm
Diameter: 50mm
CAS Number: 7440-50-8
UOM Code: 325-289-65
Discounts applied for volume purchases
