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Grade: Cirlex® CL
Formula: PI
Form: Foil/Film/Sheet
Material: Polyimide (PI)
Commodity: Polymers
Cirlex® CL PI Film provides stable electrical insulation and mechanical support in high-heat, vacuum, and radiation-exposed environments for industrial, laboratory and research applications. It is used in semiconductor fabrication for wafer carrier components, in aerospace systems for thermal and electrical insulation, and in high-energy detectors as a structural layer. Its low outgassing and dimensional stability make it suitable for cleanroom and vacuum applications. Cirlex®’s resistance to chemicals and thermal cycling ensures long-term reliability in precise R&D assemblies and instrumentation. It is also used in cryogenic cabling, superconducting qubit packaging, radiation detectors, and deep-UV lithography setups where low dielectric loss and thermal endurance are critical.
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Tolerances

Foil/Film/Sheet
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 02-Mar
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 22
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60

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