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Grade: Cirlex® CL
Formula: PI
Form: Foil/Film/Sheet
Material: Polyimide (PI)
Commodity: Polymers
Cirlex® CL PI films is a heat-resistant polyimide film supplied by Goodfellow. With 66 variations available, this film offers a range of thicknesses, sizes and surface finishes. Known for its thermal stability, low density and chemical resistance, Cirlex® CL PI films has applications in flexible printed circuits, wire and cable insulation, and aerospace composites where weight savings and durability at high temperatures are critical. This versatile engineering film enables lightweight, high-performance designs across electronics, energy, and transportation.
Technical Data Sheet Safety Data Sheet Tolerance Properties
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Tolerances

Foil/Film/Sheet
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 02-Mar
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 22
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60

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