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Grade: Cirlex® CL
Formula: PI
Form: Foil/Film/Sheet
Material: Polyimide (PI)
Commodity: Polymers
Cirlex® CL PI films is a heat-resistant polyimide film supplied by Goodfellow. With 66 variations available, this film offers a range of thicknesses, sizes and surface finishes. Known for its thermal stability, low density and chemical resistance, Cirlex® CL PI films has applications in flexible printed circuits, wire and cable insulation, and aerospace composites where weight savings and durability at high temperatures are critical. This versatile engineering film enables lightweight, high-performance designs across electronics, energy, and transportation.
Tolerances
Foil/Film/Sheet
| Thickness | ±20% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Poor |
| Acids - dilute | Fair |
| Alcohols | Poor |
| Alkalis | Poor |
| Aromatic hydrocarbons | Good |
| Greases and Oils | Good |
| Halogenated Hydrocarbons | Good |
| Halogens | Fair |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.42 |
| Hardness - Rockwell | E52-99 |
| Elongation at break( % ) | Aug-70 |
| Tensile modulus( GPa ) | 02-Mar |
| Izod impact strength( J m⁻¹ ) | 80 |
| Tensile strength( MPa ) | 70-150 |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 3.4 |
| Dissipation factor @ 1kHz | 0.0018 |
| Dielectric strength( kV mm⁻¹ ) | 22 |
| Surface resistivity( Ohm/sq ) | 10¹⁶ |
| Volume resistivity( Ohmcm ) | 10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | V0 |
| Radiation resistance | Good |
| Refractive index | 1.66 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 53 |
| Water absorption - over 24 hours( % ) | 0.2-2.9 |
| Density( gcm⁻³ ) | 1.42 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 1.8MPa( C ) | 360 |
| Lower working temperature( C ) | -270 |
| Upper working temperature( C ) | 250-320 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1090 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.35@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 30-60 |
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