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C-Solder Alloy Foil (Sn based)
C-Solder Alloy Foil (Sn based) is made from a proprietary alloy composition and offers high electrical and thermal conductivity, as well as excellent ductility. This foil is designed for use as a bonding medium in electronic packaging and heat sink applications. We offer C-Solder® Foil in 6 thicknesses and dimensions to suit different production needs.