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C-Solder® Foil (Light Tight) (Sn Based)

Our C-Solder® Foil (Light Tight) (Sn Based) range offers a series of lead-free solder foils designed for electronics assembly and packaging applications. Available in 3 thicknesses, from 25 to 100 microns, this high-purity tin/copper/silver alloy foil offers excellent wetting and fatigue resistance. With its low melting point of around 227°C, it enables lead-free soldering processes while minimizing component warpage. This makes C-Solder® Foil (Light Tight) (Sn Based) ideal for creating reliable solder joints in temperature-sensitive microelectronics and optoelectronics packaging.
Formula: Sn based
Thickness: 1mm
Length 1: 5mm
Length 2: 500mm
Type: Solder
UOM Code: 649-952-51
SKU: 1000180047
Product Code: SA25-FL-000100
Technical Data Sheet
Safety Data Sheet
$481.65
each
  • Buy 5 for $390.14 each and save 19%
  • Buy 10 for $356.42 each and save 26%
No Minimum order Approx. 2 weeks leadtime Free technical support *Free delivery worldwide

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Material Properties for Alloys

Thermal Properties
Element Value
Melting point( C ) 232
Physical Properties
Element Value
Density( gcm⁻³ ) 7.4
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