Technical Data Sheet
Safety Data Sheet

Additive Free Polymer PS Film

Additive Free Polymer PS films is part of our range of polymer films. This polystyrene film is available in 3 variations, including different thicknesses and surface finishes. These films feature high dielectric strength, chemical resistance and optical clarity. Applications of additive free polystyrene film include medical packaging, electronics insulation and optical calibration standards. With no additives, this film provides a pure polystyrene substrate for research and development purposes across scientific and industrial fields.
Grade: Additive Free Polymer
Formula: PS
Thickness: 0.05mm
Length 1: 200mm
Length 2: 200mm
Structure: Biaxially Oriented
Transparency: Clear/Transparent
UOM Code: 024-022-99
SKU: 1000002847
Product Code: ST31-FM-000150


Thickness ±20%
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Thickness ±20%
Technical Data Sheet
Safety Data Sheet

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Material Properties for Polymers

Physical Properties
Element Value
Abbe number 30.8
Flammability HB
Radiation resistance Good
Refractive index 1.59-1.6
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 19
Water absorption - over 24 hours( % ) 0.4
Density( gcm⁻³ ) 1.05
Chemical Resistance
Element Value
Acids - concentrated Fair-Poor
Acids - dilute Good-Fair
Alcohols Good-Fair
Alkalis Good-Fair
Aromatic hydrocarbons Poor
Greases and Oils Good-Poor
Halogenated Hydrocarbons Poor
Halogens Poor
Ketones Poor
Electrical Properties
Element Value
Dielectric constant @1MHz 2.4-3.1
Dissipation factor @ 1kHz 0.0002
Dielectric strength( kV mm⁻¹ ) 20
Volume resistivity( Ohmcm ) >10¹⁶
Mechanical Properties
Element Value
Hardness - Rockwell M60-90
Poisson's ratio 0.35
Elongation at break( % ) 1.6
Tensile modulus( GPa ) 2.3-4.1
Izod impact strength( J m⁻¹ ) 19-24
Tensile strength( MPa ) 30-100
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 90
Heat-deflection temperature - 1.8MPa( C ) 80
Upper working temperature( C ) 50-95
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-210
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