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DuPont™ Nomex® T411 Polyaramid Disc (Polymetaphenylene isophthalamide)

DuPont™ Nomex® T411 Polyaramid Disc is a polymetaphenylene isophthalamide foil offered by Goodfellow within their range of polyaramid products. This high-performance polymer exhibits excellent thermal, chemical, and radiation resistance. With its combination of high strength and stiffness, Nomex® is widely used in electrical insulation, high-temperature filtration, and protective apparel applications. Notably, the NASA Advanced Crew Escape Suit utilizes Nomex® for maximum astronaut safety and maneuverability. Goodfellow's Nomex® foils provide researchers and engineers with a versatile polyaramid material for testing and development across industries.
Grade: DuPont™ Nomex® T411
Formula: Polymetaphenylene isophthalamide
Thickness: 0.38mm
Diameter: 10mm
Production Method: Uncalendered Paper
UOM Code: 642-777-91
SKU: 1000029934
Product Code: AR31-FM-000181

Tolerances

Disk
Thickness ±20%

Tolerances

Disk
Thickness ±20%
Technical Data Sheet
Safety Data Sheet
US$121.42
each
  • Buy 5 for US$98.35 each and save 19%
  • Buy 10 for US$89.85 each and save 26%
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Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Good-Fair
Alcohols Good
Alkalis Good-Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Ketones Good
Electrical Properties
Element Value
Dielectric constant @1kHz 2.3
Dielectric strength( kV mm⁻¹ ) 32
Volume resistivity( Ohmcm ) 6x10¹⁶
Physical Properties
Element Value
Radiation resistance Good
Limiting oxygen index( % ) 29
Water absorption - equilibrium( % ) 9
Water absorption - over 24 hours( % ) 0.08
Density( gcm⁻³ ) 1.38
Mechanical Properties
Element Value
Elongation at break( % ) 9
Izod impact strength( J m⁻¹ ) 533unnotched
Tensile strength( MPa ) 1800-3900
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 149
Upper working temperature( C ) 200-300
Specific heat( J K⁻¹ kg⁻¹ ) 1200
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.13@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 20
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