Technical Data Sheet
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Silicon Pellets

Silicon Pellets are a form of silicon offered by Goodfellow as part of their range of pellet products. Silicon has a diamond cubic crystal structure and is an intrinsic semiconductor with good thermal conductivity and high resistivity. Silicon pellets can be used in semiconductor device fabrication where a source of high purity silicon is required. They are also used as an alloying agent with other metals like aluminum and copper to improve hardness and wear resistance. With their range of pellets, Goodfellow provides the convenience of purchasing small amounts of materials in pellet form for research and development applications.
Formula: Si
Percentage Purity: 99.99%
Maximum Lump Size: 25mm
Weight: 2000g
Structure: Polycrystalline
CAS Number: 7440-21-3
UOM Code: 303-579-41
SKU: 1000129038
Product Code: SI00-LP-000101

Tolerances

Pellets
Maximum Lump Size Nominal
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Tolerances

Pellets
Maximum Lump Size Nominal
Technical Data Sheet
Safety Data Sheet

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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 14
Crystal structure Diamond
Electronic structure Ne 3s² 3p²
Valences shown 4
Atomic weight( amu ) 28.0855
Thermal neutron absorption cross-section( Barns ) 0.16
Photo-electric work function( eV ) 4.2
Natural isotope distribution( Mass No./% ) 30/ 3.10
Natural isotope distribution( Mass No./% ) 29/ 4.67
Natural isotope distribution( Mass No./% ) 28/ 92.23
Atomic radius - Goldschmidt( nm ) 0.117
Ionisation potential( No./eV ) 5/ 167
Ionisation potential( No./eV ) 1/ 8.15
Ionisation potential( No./eV ) 2/ 16.3
Ionisation potential( No./eV ) 3/ 33.5
Ionisation potential( No./eV ) 4/ 45.1
Ionisation potential( No./eV ) 6/ 205
Mechanical Properties
Element Value
Hardness - Mohs 7
Material condition Polycrystalline
Poisson's ratio 0.42
Bulk modulus( GPa ) 100
Tensile modulus( GPa ) 113
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 23 x 10¹⁰@20@20°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) -41.56
Physical Properties
Element Value
Boiling point( C ) 2355
Density( gcm⁻³ ) 2.34@20°C
Thermal Properties
Element Value
Melting point( C ) 1410
Latent heat of evaporation( J g⁻¹ ) 13700
Latent heat of fusion( J g⁻¹ ) 1650
Specific heat( J K⁻¹ kg⁻¹ ) 703@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 80-150@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 4.7-7.6@0-100°C
Other Customers Purchased
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