Boron Nitride Sputtering Target

Boron Nitride Sputtering Targets are used for thin film deposition techniques like magnetron sputtering. These high purity discs are available in 3 size variations up to 3” diameter. The hexagonal crystal structure of boron nitride gives them excellent thermal conductivity, electrical insulation and lubricity. Common applications include semiconductor device fabrication, hard protective coatings and thermally conductive fillers.

Boron Nitride Sputtering Target Formula: BN
Thickness: 3mm
Diameter: 76.2mm
Production Method: Hot Isostatic Pressed
CAS Number: 10043-11-5
UOM Code: 829-880-49

410.81 each Ex VAT

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Boron Nitride Sputtering Target Formula: BN
Thickness: 3mm
Diameter: 25.4mm
Production Method: Hot Isostatic Pressed
CAS Number: 10043-11-5
UOM Code: 735-414-82

245.83 each Ex VAT

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Boron Nitride Sputtering Target Formula: BN
Thickness: 3mm
Diameter: 50.8mm
Production Method: Hot Isostatic Pressed
CAS Number: 10043-11-5
UOM Code: 254-990-32

307.77 each Ex VAT

Discounts applied for volume purchases

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Boron Nitride Sputtering Target