Kapton® FN Polyimide Disk is a precision-cut circular component in DuPont™ Kapton® FN — a heat-sealable composite of Kapton® HN polyimide with Teflon® FEP fluorocarbon resin on one or both faces — available in 120, 150, and 200 gauge (total thicknesses of 0.030, 0.035, and 0.050 mm). The disk drops directly into lamination stacks, capacitor assemblies, sensor housings, and compact electromechanical sub-assemblies without further cutting — eliminating the handling steps that come with sheet or coil stock wherever the application calls for a defined circular area of heat-sealable polyimide-FEP composite.
The three gauges differ in FEP construction and bonding geometry. 120FN carries FEP on both faces, suiting symmetric lamination assemblies where heat-seal access from either side is useful. 150FN has FEP on one face and bare Kapton® HN on the other — the right choice when one surface must seal and the other insulate. 200FN is the heaviest gauge, for components that need to resist mechanical abrasion or carry a greater voltage stress.
The Kapton® HN core provides full thermal endurance and chemical resistance across all gauges, with continuous service from cryogenic to above 200°C and UL 94 V-0 compliance. All gauges are MIL-P-46112B and ASTM D-5213 certified, traceable to DuPont specification. In research, the disk format supports dielectric breakdown testing, heat-seal strength measurement, and thermal lamination studies where a defined circular specimen geometry and a traceable substrate are both experimental requirements.
For customers requiring custom sizes or finished components rather than raw stock, Goodfellow offers precision cutting and micromachining services to drawing and specification.
Linear dimensions ±1mm (<100mm) or +2/-1% (>=100mm)
Volume range
Prototype quantities through to several hundred-piece production runs
Lead time
Custom sizes: 48 hours to 1 week Complex geometries: ~2-4 weeks from confirmed drawing
Laser micromachining
For complex geometries requiring tight tolerances or intricate features beyond conventional machining, Kapton® can be processed via laser micromachining through our microfabrication division, with a standard achievable target around 2 µm (tolerance +2/−1 µm)
Technical support
Goodfellow can review customer drawings and advise on design improvements for functionality and cost reduction.
To discuss a custom Kapton® component, please submit a quote request or contact us and we will come back to you within 48 hours.
Key Features
Kapton® FN Polyimide Disk is a precision-cut circular component in DuPont™ Kapton® FN, a heat-sealable composite of Kapton® HN polyimide film with Teflon® FEP fluorocarbon resin on one or both faces. Available in three gauges and certified to MIL-P-46112B and ASTM D-5213:
Ready-to-Use Disk Geometry
The disk geometry provides a ready-to-use format for direct integration into lamination stacks, capacitor assemblies, sensor housings, and electromechanical sub-assemblies. No further cutting or forming is required where a defined circular area of heat-sealable polyimide-FEP composite is needed.
120FN (0.030 mm): FEP Both Faces, 4,200 V/mil Minimum Breakdown
At 0.030 mm total thickness, 120FN carries FEP on both faces at a minimum dielectric breakdown of 4,200 V/mil (165 kV/mm), allowing heat-seal bonding on either surface. It is suited to symmetric lamination assemblies and capacitor insulation disks.
150FN (0.035 mm): FEP One Face, Directional Bonding
At 0.035 mm total thickness, 150FN carries FEP on one face only, providing directional bonding capability for stacked assemblies where one surface must seal and the other present a bare polyimide interface.
200FN (0.050 mm): Most Robust, 3,200 V/mil Minimum Breakdown
At 0.050 mm total thickness, 200FN is available in single- and double-sided FEP constructions. It is the thickest and most mechanically robust disk in the range, with a minimum dielectric breakdown of 3,200 V/mil (126 kV/mm), suited to motor insulation components and transformer lamination elements.
Kapton® HN Core Properties & Certifications
Across all gauges, the Kapton® HN core retains tensile strength of 165 MPa and elongation of 45% minimum. All gauges carry MIL-P-46112B and ASTM D-5213 certification and a UL thermal index of 200–220°C (mechanical) and 220–240°C (electrical) under file E39505.
Industrial Applications
Kapton® FN Polyimide Disk is used across motor insulation, transformer lamination, capacitor assembly, and research sectors where a precision circular heat-sealable polyimide-FEP component is required:
120FN disks (0.030 mm) are used in symmetric lamination assemblies and capacitor insulation applications, where FEP on both faces allows heat-seal bonding on either surface and the 4,200 V/mil minimum dielectric breakdown provides a high-voltage insulation margin in a compact circular geometry.
✦ Stacked Assemblies with Directional Bonding
150FN disks (0.035 mm) are used in stacked assemblies requiring directional bonding, where FEP on one face enables heat-seal bonding on the sealable side while presenting a bare polyimide interface on the other.
✦ Motor Insulation Components & Transformer Lamination Elements
200FN disks (0.050 mm) are used in motor insulation components and transformer lamination elements, where the greatest mechanical robustness and abrasion resistance in the range, combined with a 3,200 V/mil minimum breakdown, provide the dielectric margin and durability required in high-stress winding environments.
Used in sensor housings and electromechanical sub-assemblies, where the ready-to-use disk geometry and heat-sealable FEP surface allow direct integration of a certified polyimide-FEP insulating layer without further cutting or forming.
✦ Heat-Seal Strength & Dielectric Breakdown Research
Used in sample-scale heat-seal strength measurement, dielectric breakdown characterization, and thermal lamination studies across the 0.030 mm, 0.035 mm, and 0.050 mm gauge range, where the disk geometry and ASTM D-5213 traceable DuPont substrate are both experimental requirements.
Frequently Asked Questions
Answers to the questions we are asked most often about Kapton® FN Polyimide Disk, covering its composite construction, gauge options, bonding capability, typical applications, and when to choose disk over film or coil format:
What is Kapton® FN Polyimide Disk?
Kapton® FN Disk is a precision-cut circular component in DuPont Kapton® FN — a composite of Kapton® HN polyimide film with Teflon® FEP fluorocarbon resin on one or both faces — available in diameters from 4 mm to 50.8 mm in three gauges (0.030 mm, 0.035 mm, 0.050 mm). It provides a ready-to-use circular piece of heat-sealable polyimide-FEP composite for direct integration into lamination stacks, capacitor assemblies, sensor housings, and electromechanical sub-assemblies, without requiring in-house cutting from flat film.
What does the FEP layer enable in a disk assembly?
The Teflon® FEP layer on one or both faces of the disk enables heat-seal bonding to adjacent film layers or copper surfaces under heat and pressure, without adhesive. Film-to-film peel strengths of 700 g/in (2.7 N/cm) and film-to-copper peel strengths of 300 g/in (1.2 N/cm) minimum are achieved. In disk applications this means the component can be integrated into a lamination stack or capacitor assembly and sealed in place thermally — eliminating adhesive bonding steps and their associated outgassing, thickness, and process complexity, which is particularly valuable in compact assemblies where every layer adds to overall thickness.
What are the three gauge options and how do I choose between them for disk applications?
The 120FN (0.030 mm) grade carries FEP on both faces at the highest minimum dielectric breakdown in the range, allowing heat-seal bonding on either surface — the correct choice for symmetric lamination assemblies and capacitor insulation disks where bilateral bonding is required. The 150FN (0.035 mm) grade carries FEP on one face only, providing directional bonding for stacked assemblies where one surface must seal and the other present a bare polyimide interface. The 200FN (0.050 mm) grade is available in single- and double-sided FEP constructions and offers the greatest mechanical robustness — the correct choice for motor insulation components and transformer lamination elements where greater thickness and abrasion resistance are required.
What certifications does Kapton® FN Disk carry?
All gauges are certified to MIL-P-46112B and ASTM D-5213. The UL thermal index across all gauges is 200–220°C for mechanical properties and 220–240°C for electrical properties under UL file E39505. These certifications confirm the material's suitability for aerospace, military, and industrial electrical insulation applications.
What is the operating temperature range of Kapton® FN Disk?
Kapton® FN Disk maintains continuous service from −269°C to +400°C, with shrinkage at 400°C controlled to 2.5% maximum in both directions. This ensures the disk maintains its geometry and dielectric performance through thermal processing cycles and in service at elevated temperatures in motor, transformer, and aerospace insulation applications.
What are the primary applications for Kapton® FN Disk?
Kapton® FN Disk is used in symmetric lamination assemblies and capacitor insulation, where 120FN disks provide bilateral heat-seal bonding and a high minimum dielectric breakdown voltage in a compact circular geometry; stacked assemblies with directional bonding, where 150FN disks seal on one face and present bare polyimide on the other; motor insulation components and transformer lamination elements, where 200FN disks provide the greatest mechanical robustness and abrasion resistance in the range; sensor housings and electromechanical sub-assemblies, where the ready-to-use disk geometry allows direct integration without additional cutting or forming; and sample-scale heat-seal strength measurement and dielectric breakdown characterisation across all three gauges.
Is Kapton® FN Disk suitable for research and characterisation work?
Yes. The disk geometry and ASTM D-5213-certified DuPont substrate make it well suited to sample-scale heat-seal adhesion strength measurement, dielectric breakdown testing, and thermal lamination characterisation across the three gauges. The pre-cut circular format eliminates sample preparation variability when testing requires a defined circular geometry.
When should I choose disk format over film or coil?
Choose disk when the component is circular in plan and requires a pre-cut piece for direct integration — lamination stack inserts, capacitor insulation layers, sensor housing seals, and motor insulation components are natural disk applications. Film sheet is appropriate when the geometry is non-circular or larger than the stock disk diameter range. Coil is the correct format when the process runs continuously from a roll — automated winding, tape-laying, and roll-to-roll lamination lines all require coil format rather than individual pieces.
What diameters and thicknesses are available, and can custom sizes be supplied?
Kapton® FN Disk is available in all three gauges in diameters from 4 mm to 50.8 mm. Diameter tolerance is ±0.5 mm; thickness tolerance is ±20%. Custom diameters and non-standard sizes are available on request. Request a quote with your gauge, diameter, FEP construction, and required quantity.