Technical Data Sheet
Safety Data Sheet

Boron Sputtering Target

Boron Sputtering Targets are part of our extensive range of sputtering targets. With 7 variations available, these discs comprise 99.5% boron and 0.5% carbon. Their high purity and uniform composition make them ideal for thin film deposition and coating applications across industries like electronics, optics and semiconductor manufacturing. These discs can be mounted to create boron coatings on substrates via sputter deposition processes. We offer boron in disc form to enable customizable sputtering target geometries.
Thickness: 3mm
Diameter: 25mm
Technical Name: Boron
Formula: B
Percentage Purity: 99.6%
Density: 2.34g/cm³
CAS Number: 7440-42-8
Production Method: Hot Pressed
UOM Code: 412-801-51
SKU: 1000035062
Product Code: B-00-ST-000100
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Technical Data Sheet
Safety Data Sheet

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Material Properties for Metals

Atomic Properties
Element Value
Atomic number 5
Crystal structure Tetragonal
Electronic structure He 2s² 2p¹
Valences shown 3
Atomic weight( amu ) 10.81
Thermal neutron absorption cross-section( Barns ) 672
Photo-electric work function( eV ) 4.5
Natural isotope distribution( Mass No./% ) 11/ 80.2
Natural isotope distribution( Mass No./% ) 10/ 19.8
Atomic radius - Goldschmidt( nm ) 0.097
Ionisation potential( No./eV ) 4/ 259
Ionisation potential( No./eV ) 2/ 25.2
Ionisation potential( No./eV ) 1/ 8.30
Ionisation potential( No./eV ) 5/ 340
Ionisation potential( No./eV ) 337.9
Mechanical Properties
Element Value
Hardness - Mohs 9.5
Material condition Arc melted
Tensile modulus( GPa ) 441
Tensile strength( MPa ) 1580-2410
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 1.8x10¹²@27@27°C
Physical Properties
Element Value
Boiling point( C ) 3700
Density( gcm⁻³ ) 2.34-2.37@20°C
Thermal Properties
Element Value
Melting point( C ) 2180
Latent heat of evaporation( J g⁻¹ ) 35000
Latent heat of fusion( J g⁻¹ ) 2090
Specific heat( J K⁻¹ kg⁻¹ ) 1030@25°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 8.3@0-100°C
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