29–30 SEPTEMBER 2026 | EXCEL LONDON, UK | STAND E26
170,000+ specialist materials. One partner for microelectronics.
Goodfellow is exhibiting at Microelectronics UK 2026! Across four stages, this event, which is delivered in association with the UK Government's Department for Science, Innovation and Technology (DSIT) and Department for Business and Trade (DBT), offers the microelectronics industry a broad programme covering semiconductors, photonics, embedded Systems and a ‘Start-up Launchpad’.
If you’re specifying materials for a new device, process or chip design, sourcing a hard-to-find substrate in research quantities, or need precision microfabrication, visit us at Stand E24 to discuss your requirements with our team.
Laser-drilled micro-hole array patterned onto a silicon wafer
WHAT YOU’LL FIND AT STAND E26
Advanced Materials
- High-purity metals and precious metals, with purities up to 99.9999%
- Compound semiconductor substrates
- Rare earth metal oxides
- A wide range of polymers: Kapton, PTFE, PEEK, Mylar, and more
- Thermal management materials, including thermal interface materials and heat sinks
Available as precision-engineered foils, sputtering targets, single crystals, microfoils and more – sourced quickly, in research-to-production quantities, with no minimum order value.
Microfabrication of custom parts with feature sizes down to 2 microns
- Precision laser-processing of a wide range of materials, including metal, glass, silicon, polymers, and composites
- CNC micro machining for tight-tolerance components
- Micro-hole drilling
- Laser micromachining, cutting and patterning, including electrode fabrication via laser ablation
- Precision bonding, assembly, and welding
- High-resolution 3D printing and hot embossing
Flexible laser capabilities tailored to your specs, using a variety of laser sources and custom systems / processes when necessary to take your project seamlessly from prototype to production.
Talk to our experts
Our team can help you compare materials, select suitable forms and specifications, and plan the transition from small test batches towards production. Bring a drawing, sample or testing requirement to discuss feature sizes, tolerances, repeatability and next steps with our team.
