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Your global supplier for materials

TechConnect World Innovation Conference and Expo

Hynes Convention Center, Boston, MA, USA

17 - 19 June 2019

https://www.techconnectworld.com/World2019/

For over 20 years the TechConnect World Innovation Conference and Expo has connected top applied research and early-stage innovations from universities, labs, and startups with industry end-users and prospectors.

The 2019 TechConnect World Innovation event includes the annual SBIR/STTR Spring Innovation Conference, Spring AI TechConnect, the TechConnect Technical Program - more than 35 world-class technical symposium, and the Nanotech Conference Series – the world's largest and longest running nanotechnology event.

Stop by the Goodfellow booth to see what’s new at Goodfellow:

Additive manufacturing materials:  

  • Metal, alloy and ceramic powders
  • Metal and alloy wires
  • Polymer monofilaments

 

C-Solder – tin-based, flux-free soldering alloys for joining:

  • Carbon materials including carbon fibers or carbon nanotube fibers in carbon-carbon arrangements
  • Carbon to metals (e.g., copper, aluminum, titanium, stainless steel), ceramics and glass materials
  • Aluminum to aluminum without using flux

 

Materials for advanced energy technologies: 

  • Precious metals
  • Graphene
  • Fecralloy® foil, foam, rods, etc.

 

If you would like more information before the show or would like to meet with us at a specific time while you’re in Boston, please contact Ron Clawson at ron.clawson@goodfellowusa.com or call 1-800-821-2870 to set up an appointment.

In the meantime, be sure to check out our comprehensive online catalog containing more than 500 different materials in 32 forms. There’s always something new!