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High Thermal Conductivity Silicon Nitride

Goodfellow can now offer high thermal conductivity Silicon Nitride. This material is ideal for specialist applications, and offers several benefits.

  • High thermal conductivity of 100W/mK. Which is 4X higher than standard Silicon Nitride. 
  • High fracture toughness. 
  • Can be polished to a surface roughness of Ra = 0.02um.  
  • Excellent mechanical properties.

Typical Properties of this material

Properties

Units

High Thermal Conductivity Silicon Nitride

Density

g/cm3

3.3

Flexural Strength

(25°C) (MPa)

700

Linear Expansion Coefficient

(25-800°C) (1/K)

3x10-6

Thermal Conductivity

W/mK

100

Youngs Modulus

GPa

312

Poissons Ratio

 

0.29

Volume Resistivity

 

>1013

Typical Applications

  • Power module substrates
  • Various types of heat sinks
  • LED mounting substrates
  • High frequency circuit substrates

Shapes and sizes available

The standard substrate size is 100mm x 100mm with a 0.32mm thickness. Different sizes and thicknesses are available upon request.